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Oxide Thickness

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  1. ASM demonstrates ALD, hafnium high-k metal gate at 14nm

    Article

    Tue, 6 Dec 2011

    Amsterdam:ASM) created a new 14nm high- k gate dielectric process that achieved less than 6angstroms equivalent oxide thickness (EOT), while maintaining gate leakage below 1A/cm 2 , on a customer's 14nm R&D semiconductor manufacturing

  2. AMAT debuts DRAM fab tools for denser transistors

    Article

    Wed, 6 Jul 2011

    surface nitrogen content (Fig. 2). Higher nitrogen content leads to higher capacitance, thus enabling equivalent oxide thickness (EOT) scaling. Figure 2. The gate dielectric/oxide. Decoupled plasma nitridation enables high surface nitrogen

  1. AMAT's DRAM fab tools for denser transistors

    Print

    Thu, 1 Sep 2011

    surface nitrogen content ( Fig. 1 ). Higher nitrogen content leads to higher capacitance, thus enabling equivalent oxide thickness (EOT) scaling, explained David Chu, global products management at Applied Materials. Figure 2. Logic-derived

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