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Download the new standard, SEMI PV17-0611: Specification for Virgin Silicon Feedstock Materials for Photovoltaic Applications, covering virgin silicon feedstock materials grades, terminology, and tests to validate materials.
Techcet's Michael A. Fury continues his reporting from SEMICON West, reviewing talks at the NCCAVS CMP User Group forum, as well as a breakfast seminar with outlooks on the semiconductor and related industries.
SolRayo completed its Phase I STTR work with a successful nano coating that improves lithium battery life by a factor of 3 in high-temperature extreme environments. The company is looking to a Phase II grant and commercial partners.
Mike Allison, executive VP of Edwards, describes how solar photovoltaics (PV) manufacturers are looking to up productivity and drive the cost curve down, ever hunting the lowest cost/Watt.
North Carolina gave Semprius a $7.88+ million incentives package to build its pilot production plant in Henderson, NC. The plant could employ over 200 people with 35MW capacity.
Scientists from A*STAR and the National University of Singapore heated buckyballs on a ruthenium substrate until the carbon masses fell apart into graphene-based quantum dots. The technique could be tuneable.
Cambrios Technologies Corporation announced that the company’s ClearOhm silver nanowire coating materials have been combined with Hitachi Chemical’s photosensitive film technology to develop a very highly transparent conductive film that can be transferred to various substrates such as glass, ...
STMicroelectronics (NYSE: STM) opened 2 2011 iNEMO Campus Design Contests, in China and Taiwan. The contest encourages students and young engineers to design innovative products based on STM's iNEMO MEMS platform.
Industry analyst firm NanoMarkets has released its latest report on the transparent conductor market. It states that the market opportunities for the transparent conducting oxides, polymers and nanomaterials used in display, photovoltaics and other applications will exceed $6.9 billion in ...
Dr. Phil Garrou summarizes the significant commercial strides made over the past 12 months in 3D IC integration -- as defined vs. other "3D" technologies -- thanks to the promised combination of low cost and high performance.