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Presentations at this year's International Symposium on Microelectronics (IMAPS, San Jose, Nov. 1-5) included discussion of TSV/3D integration challenges and temporary bonding steps qualified for different process flows, and a wafer-level packaging (WLP) encapsulation process and stacked multi-chip
Presentations at the International Symposium on Microelectronics (IMAPS, Nov. 1-5) included discussion of through-silicon via (TSV) /3D integration challenges and temporary bonding steps qualified for different process flows, and a wafer-level packaging (WLP) encapsulation process and stacked
Continuing functional enhancement of portable consumer and computing products challenges electronics industry OEMs to provide these products in smaller and lighter form factors.
technologies as the first plasma flat panel display based on gas discharge, the first and next three generations of multichip packaging based on 35-layer alumina and 61-layer LTCC with copper and copper-polymer thin film, and materials for
is an MCM. The history of multichip packaging is long and continuous. Known ..... a serious problem for any multichip packaging approach because defective ..... enabled significant strides in multichip packaging applications. 3-D Packaging
preparation for work on AMD's Fusion microprocessor which has integrated graphics capabilities, and for which multichip packaging and wafer-level packaging methods would reduce production costs and manufacturing risks. TSMC has been the major
specifically cellular phones. While semiconductor packaging technologies such as chip-scale packaging (CSP) and multichip packaging (MCP) have driven the miniaturization of wireless products over the past several years, there is significant
preparation for work on AMD's Fusion microprocessor which has integrated graphics capabilities, and for which multichip packaging and wafer-level packaging methods would reduce production costs and manufacturing risks.
inspection capability, which can detect existing defects and preempt further process investment, is multiplied in multichip packaging (MCP) applications by the large investment already made in multiple, fully processed die and the unrecoverable
committee (JC-63) has been formed to address the need for cooperation in the SIP area by working on standards for multichip packaging . In general, this and other efforts promoting cooperation among the many types of participants in SIP are needed