Multi-Chip Packages
Multi-Chip Packages news and technical articles from Solid State Technology Magazine. Search Multi-Chip Packages latest and archived news and articles
-
PACKAGING BEAT: Standards, “platformization” mulled at IEEE memory workshop
… Monterey, CA, Feb. 12-16), but a panel discussion on packaging and test, including the need for standards for multi - chip packages (MCPs), reminded the participants that the final manufacturing steps are essential for enabling successful …
-
Part II, SEMI Forum: Mapping progress in 3D IC integration
… loom larger, designers are increasingly turning to multi - chip packages as a means to enhance system performance without ..... speed up single-chip processors, wiring delays in multi - chip packages would still hinder performance. True 3D integration …
-
MCP Memory Test Verigy
Performing quality assurance (QA), characterization, and small-lot production, the V5000ep builds on the V5000e platform with increased automation, testing and characterizing all memory types from wafer sort through final test. When testing multi-chip packages (MCPs), the system uses proprietary ...
-
Tessera and MEI Sign Technology Licensing Agreement
(November 15, 2004) San Jose, Calif.—Tessera Technologies Inc., a technology developer, licensor, and product development services provider for semiconductor chip scale and multi-chip packages (CSPs and MCPs), announces that it has signed a new technology licensing agreement with Matsushita ...
-
Sharp and Tessera expand license terms of existing agreement
(August 2, 2004) San Jose, Calif.—Tessera Technologies, Inc., a services provider for semiconductor chip-scale and multi-chip packages , announced today that it has signed an agreement that expands the license terms of its existing agreement with Sharp Corporation, a leading consumer electronics ...
-
Tessera and Taiwan-based Walton Advanced Electronics Ink New Licensing Agreement
SEMICON West, SAN JOSE, Calif. - July 17, 2002 - Tessera Technologies, a premier developer of intellectual property and services for chip-scale and multi-chip packages (CSPs and MCPs), today announced that Taiwan's Walton Advanced Electronics has signed a Tessera Compliant Chip license that will ...
-
NOR Flash makers balance cellphone slowdown with new design wins
… Tablet devices from Samsung tended to incorporate the company’s own brand, higher-density NOR flash in multi - chip packages , while other branded tablets preferred discrete low-density SPI parts. In the automotive space, NOR flash …
-
LEDs revenues grow even as prices fall through 2016
… lighting is forecast to grow 10%. In 2011, all major players in the LED industry made a big push in the sales of multi - chip packages (MCP). The use of high-lumen-output packages helps reduce the size of the light source as well as the time …
-
Supply chain readiness in an era of accelerated change
… Currently, there are no collaboration models to solve this foundry-OSAT-IDM and fabless chip matrix for complex, multi - chip packages . SEMI standards are addressing many supply chain, equipment and materials issues. However, market demand and …
-
CMOS power amplifiers grab market share from GaAs
… see massive adoption of SOI technology, which started in 2010. New packaging technologies now enable compact multi - chip packages of Rx modules, PA modules, multi-duplexers, and other RF technologies . The evolution of architecture towards …
