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line of high-end metrology systems: the EX-300 metrology tool targeted for front-end process control of 22nm technology nodes and beyond. The EX-300 is a versatile metrology tool based on LEXES (Low-energy Electron induced X
product marketing manager at KLA-Tencor, discusses the design decisions that drove the company’s new film metrology tool -- the Aleris 8330 -- targeted for non-critical films at 32nm and below. Among the drivers -- especially for
August 4, 2003 - Nikon Semiconductor Inspection Technologies Group (SITECH) has unveiled a metrology tool designed for the 90nm node and below. The NRM-3100 is designd to measure lithographic exposure with enough bandwidth to accommodate
October 17, 2003 - Rudolph Technologies, Flanders, NJ, has introduced a wafer-bow/stress metrology tool for measuring stress that develops during thin film deposition. The ultra-WB uses multiple parallel laser beams rather than
SEMICON West '00. July 10, 2000 In San Francisco, Calif. today, Schlumberger Semiconductor Solutions introduced the next evolution of its sub-micron metrology tool , the IVS 135. By pennNET staff
compositions. Vantage’s CMP metrology tool orchestrates patented laser particle ..... embedded the Vantage SlurryScope CMP metrology tool in its next-generation Slurry ..... Vantage will be demonstrating its metrology tool from two booths at Semicon West
October 4, 2011 -- Tamar Technology, precision metrology tool supplier, shipped its first fully automated WaferScan ..... based measurements, such as hole diameter. The metrology tool uses optical and non-destructive methods, measuring
optics department of Carl Zeiss SMT, Lithography Optics (LIT), and external partners. Kienzle notes that the metrology tool wins “confirm the relevance of EUV technology for the industry.” Metrology tools for EUVL are an industry need
microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical ..... www.zebraoptical.com . Zebraoptical Integrated Metrology Tool (ZIMT) interferometry measurement. Follow Small
thinning and TSV expose processes. To facilitate this work, Lasertec will place a 300 mm TSV infrared (IR) etch metrology tool in SEMATECH’s 3D R&D center, providing advanced measurement capabilities that will enable accurate, repeatable TSV