Metallization
Metallization news and technical articles from Solid State Technology Magazine. Search Metallization latest and archived news and articles
-
BTU metallization tool withstands 60-million-cell test
… tested its TRITAN HV90 dual-lane metallization firing system in production of more ..... marathon test shows how dual-lane metallization can lower cost of ownership up to 30 ..... manufacturing. The TRITAN HV90 dual-lane metallization firing system processes 3600 wafers …
-
Copper PV metallization yields 18% solar cell efficiency
… conversion efficiency manufactured with copper backside metallization . The partners have been working under the Las VeGaS project ..... that focuses on the long-term stability of front side metallization of solar cells using environmentally friendly electroplated …
-
Replisaurus advanced Cu metallization process nears commercialization at Leti
… Technologies Inc., a developer of a metallization technology for integrated passives ..... ElectroChemical Pattern Replication (ECPR) metallization process to customer target products ..... Grenoble facility since Fall 2010). The metallization technology is now ready on a master …
-
DuPont PV metallization paste formulated for R2R thin-film PV fab
… DuPont Solamet PV414 photovoltaic (PV) metallization paste for application via rotary screen ..... qualified the DuPont Solamet photovoltaic metallization paste in its thin film R2R process ..... and mobile solar applications. The metallization paste is formulated to avoid waste …
-
BTU metallization tool optimized for volume Si PV fab
… Nasdaq:BTUI ) debuted the TRITAN HV90 metallization firing system for silicon photovoltaics ..... manufacturers switching to dual-lane metallization can expect a 35% increase in capital ..... BTU product marketing manager for metallization products. In trials, TRITAN showed …
-
-
Metallization processes for standardized wide-IO memory applications
… on a via-last process with vias 10µm wide by 50 deep. Metallization of this type of structure poses a number of technical and ..... References 1. D. Shur et al, "Through-silicon via metallization : A novel approach for insulation/barrier/copper seed …
-
IR orders NEXX metallization systems for IGBT fab
… deposition (PVD) systems from packaging equipment maker NEXX Systems for its Newport, Wales fab. The Apollo's backside metallization capabilities will be used to make next-generation power devices, including insulated gate bipolar transistors (IGBTs …
-
Korean IDM orders NEXX tools for WLP metallization
… its Stratus ECD tools for wafer-level packaging (WLP) metallization processes for cutting-edge mobile products. The manufacturer ..... at imec in 2008 for joint research and development of the metallization of through silicon vias (TSVs) and micro-bumping. NEXX …
-
Heraeus Al-clad Cu bonding wire avoids metallization changes in power semiconductors
Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.
-
Via-last 3D packaging and interposer metallization costs chat
Steve Lerner, CEO of Alchimer, discusses the company's latest suite of through silicon via (TSV) technologies, focusing on how the platform reduces costs for advanced packaging processes.
