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CEA-Leti has revamped its RF MEMS manufacturing for higher reliability and performance, using thin-film packaging and replacing gold with ruthenium for the contacts. The design also prevents contact between the electrodes when the bridge is down.
Research and Markets has announced the availability of a new book, Reliability of MEMS.
Techcet's Michael A. Fury continues his observations from this year's IEEE International Interconnect Technology Conference (IITC) meeting near San Francisco. From Day 2: Back-end memory, MEMS , reliability /characterization, and posters spanning the breadth of interconnect topics, especially 3D TSV ...
iNEMI, Lti, Tronics Group, Yole Dveloppement and more. Attendees will help identify major technology areas where MEMS reliability , testability, performance, and cost can be improved. Participants will then begin to define collaborative projects
iNEMI's team will focus on providing possible refinements for testing in-process and at the process back-end. MEMS Reliability Methodologies - This initiative will investigate the development of generic reliability testing specifications
modules that correspond with new 3D mature technologies and customer requirements. Also read: CEA-Leti improves MEMS reliability with new packaging, ruthenium and CEA-Leti, IPDiA partner on 3D integration for passives on Si CEA is a French
eliminates liquid crystals, polarizers and color filters to enable a highly efficient, programmable display with proven MEMS reliability . CMI is one of the leading worldwide manufacturers of TFT-LCD display products, including TFT-LCD panels
based WSN has not been the sole focus of the research done in this area. In our previous work we have shown that MEMS reliability can be calculated using HPC thus making their practical applications possible [38, 37]. Effects of the failure
Creating and Maintaining Reliable Vacuum and Other Controlled Atmospheres in Hermetically Sealed MEMS Packages,” MEMS Reliability for Critical and Space Applications, Proc. SPIE, Vol. 3880, pp. 75-82, Aug. 1999. Barry D. Wissman received
Technology Wars, Harvard Business Review, pp. 86-96, March-April 1993. D. M. Tanner, et al., Science-based MEMS Reliability Methodology, Microelec. Rel. 47, 1806-1811 (2007). E. Van Kershaver, G. Beaucarne, Back-contact Solar