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  1. Deep silicon etch from Oxford Instruments offers process flexibility

    Article

    Mon, 6 Jun 2011

    Instruments debuted the PlasmaPro Estrelas100 deep silicon etch technology for the micro electromechanical system ( MEMS ) R & D and fabrication market. PlasmaPro Estrelas100's process flexibility enables use in R&D labs building nano and micro

  2. SensorsCon highlights

    Article

    Tue, 1 May 2012

    growth rate (CAGR) -- expected to increase to over 50% as new market opportunities are proven. Acceleration of the MEMS R & D cycle will be aided by the development of better software design tools and by the adoption of uniform unit processes

  1. SensorsCon highlights: MEMS in the Internet of Things, networks, and camera pills

    Article

    Thu, 22 Mar 2012

    growth rate (CAGR) -- expected to increase to over 50% as new market opportunities are proven. Acceleration of the MEMS R & D cycle will be aided by the development of better software design tools and by the adoption of uniform unit processes. The

  2. Wafer packaging database provides WLP data

    Article

    Fri, 23 Sep 2011

    graphs are included to illustrate global trends. Sample of companies listed in the database (IDMs, OSAT, foundries, MEMS , R & D Lab, etc.) Wafer bumping houses: NEPES ChipBond FCI OSAT: ASE SPIL STATS ChipPac Wafer packaging houses: Xintec

  3. memsstar expands in Silicon Glen

    Article

    Tue, 4 Oct 2011

    its Solo, Sentry and Multi process tools for advanced etch, surface preparation and deposition processes to support MEMS R & D and volume manufacturing. The new facility layout also allows memsstar to handle larger, more complex equipment. memsstar

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