Home>Topics>Memory
  1. All
  2. Article
  3. Print
  4. Text

Memory

Memory news and technical articles from Solid State Technology Magazine. Search Memory latest and archived news and articles

  1. Verigy tests GDDR5 at Korean memory producer

    Article

    Wed, 15 Jun 2011

    Verigy (NASDAQ:VRGY), semiconductor test equipment provider, won orders for its V93000 HSM platform to perform volume test on GDDR5 memory devices at a large Korean customer.

  2. Apple spends most on semiconductors; 61% for wireless products

    Article

    Thu, 9 Jun 2011

    Apple bought the most semiconductors of all original equipment manufacturers (OEMs) in 2010, largely to build iPhones and iPads, according to IHS iSuppli (NYSE: IHS) research. This is Apple's first trip to the #1 spot, after being third in 2009 and sixth in 2008.

  1. Tektronix buys Teradyne testers for better test dev, IC test range

    Article

    Wed, 8 Jun 2011

    Tektronix Component Solutions purchased 5 Teradyne J750EX semiconductor test systems to screen a wider variety of complex ASICs, increase test capacity, and generate test programs faster.

  2. FSI wins wafer clean tooling orders from FEOL and BEOL customers

    Article

    Tue, 7 Jun 2011

    FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.

  3. AMAT debuts DRAM fab tools for denser transistors

    Article

    Wed, 6 Jul 2011

    Applied Materials debuted 3 systems for next-generation DRAM chip manufacturing: the Applied Centura DPN HDTM system to improve the gate insulator scaling; the Applied Endura HAR Cobalt PVD system for high-aspect-ratio contact structures; and the Applied Endura Versa XLR W PVD system for reduced ...

  4. TSV moves to "real engineering," but reliability data needed

    Article

    Mon, 11 Jul 2011

    Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.

  5. AMEC reactive ion etch tool enables sub-28nm nodes

    Article

    Mon, 11 Jul 2011

    AMEC launched its Primo 300mm very-high-frequency advanced decoupled reactive ion etch tool for sub-28nm. AMEC's Ben Lee describes the tool's mini-batch cluster architecture, and the physics that makes it work.

  6. Power management ICs for green energy applications

    Print

    Tue, 12 Jul 2011

    Executive Overview The power management IC (PMIC) has become a critical component in virtually every electronics product today. Much of this demand is being fueled by the global transition to green energy solutions. Highlighted will be a 0.18m BCDMOS process with 30V LDMOS transistors having an Rsp

  7. Performance enhancements for multi-die DRAM packages

    Print

    Tue, 12 Jul 2011

    R. Crisp, et al., Tessera, San Jose, CA USA; W. Chang, et al., Powertech Technology Inc., Hsinchu, Taiwan, R.O.C

  8. World News

    Print

    Mon, 11 Jul 2011

    BUSINESS TRENDS VLSI tool champs prove customer service matters VLSI Research's out with its annual "Best supplier" rankings, and there's a tie atop the leaderboard. Nine-time champ Varian Semi. Equip. Assoc. and first-timer Novellus both scored 8.18 in the "large supplier" category of chipmaking

© 2012. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS