Memory Interface
Memory Interface news and technical articles from Solid State Technology Magazine. Search Memory Interface latest and archived news and articles
-
Rambus-memory-breakthroughs-enable-SoC-to-memory-differential-signaling-20Gbps-other-advances
… differential signaling for SoC-to- memory interfaces to 20 gigabits per second ..... technology, a multi-modal, SoC memory interface PHY, supporting both differential ..... differential and single-ended memory interfaces in a single SoC package design …
-
Package-on-package: thinner, faster, denser
… functions. A 0.65mm pitch memory interface density was applied to ..... provided 128 to 152 pin memory interfaces supporting combo memory ..... higher density 0.5mm memory interfaces and 0.4mm bottom BGA ..... The standard two-row memory interfaces at 0.5mm pitch (described …
-
Amkor's Packaging Presentation
… requirements in the memory interface requirements and ..... node. The same the memory interfaces . Are going up in ..... deliver higher density memory interface that can scale with ..... support high band with memory interface . But ask those …
what's going on in the handset for microprocessors. Are requirements in the memory interface requirements and so. You've summed up what some of the next generation requirements are as multimedia features and functionality continues in thatrequirements. You know how -- they develop and deliver -- higher density memory interface that can scale with the memory architectures. Without requiring new package stack. A process technologies. How to control -- -- she canon chip. Where you could -- a support -- high band with memory interface . But ask those processors now transition to flip chip for the performance reasons in the course bedecked talked about earlier. Now you need get through silicon -- is. Or huge sacrifice your performance if your processors wire bonded -- optimize here. Your process of memory interface . So that was not gonna needed and also -- had some co design time to market and test challenges. The package in -
PoP as a Preferred Packaging Solution
… reduction. Standardized memory interfaces , along with independent ..... standard pinouts for the memory interface , enabling a range of memory ..... Simultaneously, the pitch of the memory interface is being reduced from 0 ..... size and/or increase memory - interface pin count. Techniques …
-
Package on Package
… is ideal for the emerging 0.4mm pitch low-power DDR2 memory interface requirements. Additionally, it enables the stacked interface ..... PoP requirements by removing bottlenecks for fine-pitch memory interfaces , enhance warpage control and bottom package thickness …
-
Synopsys beefs up portfolio with Mosaid's DDR controller IP
… in a statement. For Synopsys, the deal adds DDR2 and DDR3 memory interfaces to its portfolio of standards-based connectivity IP. "The addition of Mosaid's DDR memory interface IP and engineering team will give our mutual customers access …
-
ISSCC 2013: Memory trends
… equalizer, and clock-feathering slew rate control technologies have been demonstrated to reduce the power dissipation of memory interfaces significantly, while achieving high bandwidth. Nonvolatile Memories In the past decade significant focus has been put …
-
Silicon interposers: building blocks for 3D-ICs
… designers the means to significantly increase the bandwidth between the logic chip and the memory (especially with wide memory interfaces ) that can't be achieved with bond wires, as well as the ability to mix and match dies that not only use different process …
-
Amkor licenses 3D packaging tech to SHINKO
… added cost, says Amkor. It also reportedly improves warpage control, reduces package thickness, enables finer-pitch memory interfaces , can be used with wire-bond and flip-chip interconnects, and supports stacked die or passive integration designs …
-
Silicon interposers: building blocks for 3D-ICs
… designers the means to significantly increase the bandwidth between the logic chip and the memory (especially with wide memory interfaces ) that can't be achieved with bond wires, as well as the ability to mix and match dies that not only use different process …
