Memory Devices
Memory Devices news and technical articles from Solid State Technology Magazine. Search Memory Devices latest and archived news and articles
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Creating phase-change memory devices with GeTe thin films
… their contributions to this project. References 1. S. J. Hudgens, "The future of phase-change semiconductor memory devices ," J. Non-Crys. Solids , 354, 2748 (2008). 2. S. L. Cho et al., "Highly scalable on-axis confined …
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US, Korea scientists make hybrid nanowire memory devices
… which they suggest is more reliable than other nanowire-based memory devices . Describing their work, the scientists say the nanowires were ..... fabrication technology than other proposals for nanowire-based memory devices , NIST says.
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Ziptronix wafer stacking tech expands to 3D memory devices
Ziptronix Inc. is helping a 3D memory device maker replace standard die stacking with its DBI wafer-stacking technology, which has been proven in image sensor packaging.
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Scientists tout telescoping nanotube switches for memory devices
February 16, 2007 - Researchers at the U. of California-Riverside have designed the building blocks for a memory device that uses telescoping binary or three-stage carbon nanotubes as high-speed, low-power microswitches.
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SEMATECH, centrotherm’s semiconductor-fab subsidiary partner on low-temp processes
… processing techniques for next-generation logic and memory devices . Continued scaling will require new materials and ..... towards usage in high performance logic transistors and memory devices in sub 14 nm advanced technology nodes. “SEMATECH provides …
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Semiconductor metrology beyond 22nm: 3D memory metrology
… for FinFETs (Part 1) and 3D memory devices , and defect detection capabilities ..... volume manufacturing. Future 3D memory devices will include multiple gate-level ..... an example of the types of 3D memory devices that will require HVM metrology …
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Verigy tests GDDR5 at Korean memory producer
… Verigy V93000 HSM6800 delivers at-speed, high-throughput, automated memory test on ultra-fast GDDR5 graphics memory devices (4Gbps+ per-pin operation). The Korean memory maker selected the V93000 HSM6800 for its test speed headroom …
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New architectures, litho schemes take the stage at SEMICON West
… The semiconductor industry is at a crossroads, with new architectures needed to continue scaling both logic and memory devices . In May, Intel surprised many by saying it will switch from a planar to a vertical FinFET transistor at the 22nm …
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Thinfilm-PARC-bring-printed-electronics-commercialization-engagement-forward
… ASA (Thinfilm) and PARC, a Xerox company, entered the next phase of their co-innovation engagement for printed memory devices . This next phase extends the engagement to prototyping the product for manufacturing readiness. PARC and Thinfilm …
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Novellus tips WN film for ≤3X memory Cu interconnects
… copper interconnect applications in 3X node and below memory devices . The "DirectFill" chemical vapor deposition (CVD ..... connecting tungsten vias to Cu interconnects in advanced memory devices . A common integration scheme for Cu interconnects …
