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  1. ACM Research Shanghai sells 1st 300mm megasonic clean tool

    Article

    Thu, 27 Oct 2011

    Ultra C 12" (300mm) single-wafer megasonic cleaning tool at a leading Korea-based ..... post-etch and pre-metal processes. Megasonic power causes cavitation to help remove ..... prevents "hot spots" where aggressive megasonic energy causes bubbles to collapse. ACM

  2. Thinned compound semiconductor wafer handling enabled by 3 Brewer Science tools

    Article

    Tue, 17 Apr 2012

    device processing: a thermal debonder, separation tool, and megasonic cleaning system. Cee 1300CSX is a semi-automatic thermal ..... materials. It handles wafers from 2” to 12”. Cee 300MXD megasonic cleaning system applies uniform acoustic energy to spinning

  1. EVG wafer clean tool installed at Tokyo Institute of Technology

    Article

    Thu, 1 Mar 2012

    station uses standard deionized (DI)-water rinse as well as megasonic , brush and diluted chemicals as additional cleaning options ..... create voids on the wafer bonding interface via the EVG301 megasonic wafer cleaning system. Tokyo Institute of Technology is the

  2. TSV fab tool combines stress-free CMP with thermal flow etch

    Article

    Thu, 27 Oct 2011

    large particles and a space-alternating phase shift (SAPS) megasonic clean removes tiny particles and oxide. An in-tool non ..... plating (Ultra ECP) chip fab tools, and single-wafer megasonic cleaning tools. Learn more at http://buyersguide.electroiq

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