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Mcms news and technical articles from Solid State Technology Magazine. Search Mcms latest and archived news and articles

  1. Advanced package technologies' growth through 2015

    Article

    Tue, 27 Dec 2011

    They come in many forms, including die stacks, package on package (PoP), package in package (PiP), TSOP stacks, QFNs, MCMs , and WLPs. Now found in all cell phones, stacked packages are in a high-demand market. Stacked package revenue will experience

  2. Teledyne Microelectronics to package Zephyr Photonics VCSELs

    Article

    Tue, 10 Jan 2012

    Microelectronics Technologies, a Department of Defense (DoD) Trusted Source for microelectronics, provides multichip modules ( MCMs ) and custom microelectronics packaging. Its parent company, Teledyne Technologies, provides sophisticated instrumentation

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