Maskless
Maskless news and technical articles from Solid State Technology Magazine. Search Maskless latest and archived news and articles
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Maskless lithography progress from the IMAGINE Workshop
September 8, 2011 -- The 2nd Maskless Lithography IMAGINE Workshop, held September ..... development of multiple electron-beam maskless lithography (ML2) technology. This ..... 22nm and below, using high-throughput maskless lithography based on MAPPER Lithography …
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MIT's maskless MEMS wafer patterning promises cheaper, higher-mix manufacturing
… diverse, adding specialization to the cost of manufacture. Researchers at Massachusetts Institute of Technology (MIT) say new maskless patterning techniques and improved computer-aided design (CAD) tools would break through these limitations. Henry Smith …
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CEA-Leti Annual Review: Update on maskless litho work
by Hughes Metras, U.S. development, Leti June 28, 2011 - Multi e-beam lithography, a maskless technology, is a recognized alternative to EUV on the International Technology Roadmap for Semiconductors for the 22nm node and …
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Dainippon Screen develops maskless direct imaging exposure system
Dainippon Screen Mfg. Co. Ltd. developed the DW-3000 direct imaging exposure system for next-generation semiconductor packaging, exposing complex 3D multilayer substrates while adjusting for warping and distortion of individual wafers.
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MAPPER Lithography tech resolves 22nm lines, spaces, contact holes in CEA-Leti work
… positive chemically amplified resist. The maskless lithography tech meets semiconductor ..... Aselta. It was formed to evaluate a maskless lithography infrastructure, using multiple ..... lithography from MAPPER. More on IMAGINE: Maskless lithography progress from the IMAGINE …
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MAPPER Lithography tech resolves 22nm
… positive chemically amplified resist. The maskless lithography tech meets semiconductor ..... Aselta. It was formed to evaluate a maskless lithography infrastructure, using multiple ..... of MAPPER's first pre-production maskless lithography Matrix systems at CEA-Leti …
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Metallization processes for standardized wide-IO memory applications
… 6µm plating = 0.6µm overburden Maskless backside isolation This new generation ..... is required, and a cost-effective maskless backside isolation (MBI) layer deposition ..... in Fig. 4 . Figure 4. Self-aligned maskless backside isolation layer deposition with …
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TEL joins CEA-Leti's lithography program IMAGINE
… IMAGINE supports the development and launch of high-throughput maskless lithography (ML2), a multiple electron-beam (e-beam ..... achieves 300mm wafer-fab-compatible directed self assembly Maskless lithography and DSA are strong candidates for future patterning …
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Imec's via-middle TSV fab 'reveals' contacts by wafer thinning/etch
… barrier and liner layers. A backside passivation layer is then applied, and TSV liner layers are selectively opened using a maskless , self-aligned dry etch process. Further interconnect layers and bump interconnects can be processed on the wafer backside …
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JSR joins lithography research at CEA-Leti
… lithography for <20nm logic applications and on direct-write maskless lithography (ML2) technology. The specific ML2 development ..... manufacturers TSMC and STMicroelectronics. It is developing a maskless lithography infrastructure and the use of MAPPER Lithography …
