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Mask

Mask news and technical articles from Solid State Technology Magazine. Search Mask latest and archived news and articles

  1. Novellus replaces TiN hard masks with ceramic for sub-22nm nodes

    Article

    Wed, 9 Nov 2011

    debuted ceramic hard mask (CHM) materials for use ..... titanium nitride (TiN) hard masks at 22nm and below: it ..... In contrast, TiN hard masks require the addition of ..... the etch of metal hard masks where non-volatile etch ..... since the ceramic hard mask materials do not require

  2. Double-patterning, topcoat-less photoresists and silicon hard masks

    Print

    Thu, 1 Sep 2011

    capabilities, the ability of mask houses and designers to ..... toward one directional mask layouts, have all paved ..... such as spin-on hard masks , freezing/shrinking ..... spin-on silicon hard mask material is packaged with spin-on organic hard masks (underlayers) to make

  1. Model-based mask data prep using overlapping shots for 20nm devices

    Article

    Tue, 16 Aug 2011

    shapes used to create the mask patterns so that the masks can be written using ..... MDP attractive for EUV masks as well. Recent tests by a leading mask writing equipment manufacturer ..... lithographic performance and mask cost of masks made by inverse lithography

  2. Mask -wafer double simulation: A new lithography requirement at 22nm

    Article

    Fri, 30 Dec 2011

    and beyond, multiple masks -- each with complex mask shapes -- are needed ..... beam) used to write masks plus mask -process effects ..... requires both reasonable mask write-times and good ..... yield. But more complex masks that produce good wafer

  3. Suss joins imec's EUV mask integrity work

    Article

    Tue, 12 Jul 2011

    aiming to develop a holistic mask management system and a sophisticated approach to preserving mask integrity prior to exposure. EUV masks don't offer protection of ..... particles and organics) on the mask patterns. A higher cleaning

  4. Ion beam optimization to reduce EUV mask blank defects

    Article

    Fri, 4 May 2012

    suppliers to improve the mask deposition technology at the Mask Blank Development Center ..... in Albany, NY. EUVL masks are composed of a substrate ..... deposition technique for such masks . FIGURE 1. Veeco Nexus ..... interaction One source of mask blank defects added during

  5. MENT, JEOL optimize multi-resolution IC mask writing process

    Article

    Thu, 24 Nov 2011

    hardware and software for advanced IC lithography mask writing. The partnership aims to develop multi ..... companies will optimize interfaces between the Mentor mask data preparation and mask process correction (MPC) software and JEOL electron

  6. Reducing mask write-time—which strategy is best?

    Article

    Tue, 1 May 2012

    directly correlates to mask write time. The addition ..... patterning, which adds more masks to the set and hence increases the overall mask writing time. The growth ..... preparation and to the mask writing equipment. The ..... for writing curvilinear masks within a reasonable shot

  7. Model-based mask data prep using overlapping shots for 20nm devices

    Print

    Sat, 1 Oct 2011

    shapes used to create the mask patterns so that the masks can be written using ..... MDP attractive for EUV masks as well. Recent tests by a leading mask writing equipment manufacturer ..... lithographic performance and mask cost of masks made by inverse lithography

  8. SPIE BACUS 2011: Having your cake and eating it too

    Article

    Wed, 5 Oct 2011

    backed up with PV Band, mask error enhancement factor ..... mimic the ideal OPC data/ mask shape to realize lithography ..... Bürgel dealt with EUV masks . He reported that sub ..... agreement was that for EUV masks , the industry is still ..... innovations applied to manage mask -writing times to reasonable

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