EVG discusses the latest wafer bonding system study results
Thu, 15 Jul 2010|
Automatically Generated Transcript (may not be 100% accurate)
Hi -- vulgar of solid -- technology magazine reporting from semi -- west my guess is Marcus -- -- on TV who will come. Morning all right well my question to you is this I know that he beat them has already announced results of work with some attack on 3-D IC wafer to wafer. Copper recovered from a compression binding and face to face -- -- can you please summarize the results of this work for our viewers. Yup absolutely. So basically. If installed on latest generation. Straight immunity temple president formatting system its -- because she -- not platform. Which includes. Precision alignment and both permanent -- options into one for the ultimate platform. So the hot -- the system is really awesome upstream TM line of which instantly just generation face to face -- -- deployment system. That enabled stuff -- column and I mean precision. And fixed there capability of the system right so flawless First Amendment accuracy goes -- -- -- to fight my constant. Which enables basic people's home and -- inaccuracies in the tough -- -- Marines. For books that talks are forming and you know what might homes receive local political performing. And the system installation. Except -- was complete -- -- of me. And those results have been reported -- do you I can -- conferencing San Francisco. Actually quite recently can't stand. Quote from basic features -- stupid stuff in -- so very proud of this accomplishment. Wilson chief executive of all apartments have been taken it real responsible -- equipment there well thank you very much history thank you.
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