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Military microelectronics experts at the US Defense Advanced Research Projects Agency (DARPA) are launching a leap-ahead technology program to develop advanced, ultralow-power non-volatile logic ICs that retain their data and computational states when power is removed.
consumer-electronics logic ICs cuts the number of required ..... consumer-electronics logic IC market that slashes the ..... commercialize profitable consumer logic ICs . The new technology ..... layer Al metallization on logic ICs for consumer electronics
manufacturing`s back end.) The XC9536 is the first programmable logic IC in a CSP, making it ideally suited for a growing number of ..... expertise is being used with passive devices and with memory and logic ICs . Wafer level CSP fabrication The "wafer level" CSP process
drain and 3D integration of a commercial DRAM chip on top of a logic IC . Imec SiGe IF-QW pFET a "viable option" for 16nm node ..... research group also integrated a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec
subsidiary to take over the company's logic IC business next year, a move that would ..... notes the Taiwan Economic News . The logic IC business, including voice ICs and computer ..... As the difference by nature between logic IC and memory IC continues to diverge day
Vincent Gu, IHS iSuppli, summarizes the drivers -- domestic demand, quality and technology expectations in consumer devices -- and the challenges -- competing for capacity, low penetration in logic ICs -- for China's fabless IC designers.
new 3D chip integrating a commercial DRAM chip on top of a logic IC . The new 3D stack resembles as close as possible to future ..... commercial DRAM product chip on IMEC’s proprietary CMOS logic IC . As an example, heaters are integrated to test the impact
At IEDM 2010, Renesas chief engineer Yoshihiro Hayashi shares details about the company's new logic IC -compatible eDRAM targeting system LSIs 28nm and below, including development of a special porous film for the interconnect layer to suppress metal contamination.
sales decline in 2012: CMOS image sensors (31.8%, light-emitting diodes (LEDs. 17.5%), application-specific logic ICs (5.6%), and sensors (4.1%). As ever in recent years, memory overall is dragging down the group with a -10.7
22091 106 27297 24 30700 12 Samsung is significantly boosting spending for logic ICs . Approximately $6.5 billion of Samsung’s 2012 capex budget is dedicated to logic ICs . Samsung is Apple’s foundry partner for the A4 and A5 application processors