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October 19, 2011 -- JSR Micro and CEA-Leti will partner to develop sub-20nm next-generation lithography materials and processes , focusing on pitch division in 193nm optical lithography for <20nm logic applications and on direct
22nm node and beyond This partnership will “rapidly increase the rate of development” for Inpria’s EUV lithography materials , said Andrew Grenville, CEO of Inpria. It will also “help strengthen the RMDC’s ability to address critical