Lithographic news and technical articles from Solid State Technology Magazine. Search Lithographic latest and archived news and articles
Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.
for the microelectronics industry, specifically, removing lithographic materials from semiconductor wafers. During the two-year ..... examined if the new technology is suitable for the removal of lithographic laquers. Subsequently, the assessment will be expanded
organic chemical vapor deposition (MOCVD) precursors for LED manufacturing, photoresists and related ancillaries for lithographic processing, metallization processes for electroplating, and pads and slurries for chemical mechanical polishing/planarization
Biocompatibility of PEDOT:TOS-PEG was successfully demonstrated. J1.6 Robert Mueller of IMEC described a low cost lithographic process for patterning S/D bottom contacts for high mobility p -type pentacene organic TFTs using silver bottom contacts
higher photoabsorption cross-sections would elicit low carbon and oxygen contamination levels in order to minimize damage to lithographic optics. Oxygen from dissociated water molecules can oxidize the mirror surface resulting in loss in reflectivity[2
transition from conventional scaling-driven planar devices to complex 3D transistor architectures, redefining future needs for lithographic , defect, and films metrology solutions for high volume manufacturing. Evaluation of critical dimension (CD), roughness
layer, under certain conditions this film grows selectively on silicon only and leaves the metal TSV plugs exposed – no lithographic step is required, and a cost-effective maskless backside isolation (MBI) layer deposition process is achieved, as shown
bonding process, so you don’t need a very accurate pick and place process, you just do the cavity definition through the lithographic process.” With respect to bonding processes needed for photonics on silicon, Leti is investigating both wafer-to
transition from conventional scaling-driven planar devices to complex 3D transistor architectures, redefining future needs for lithographic , defect, and films metrology solutions for high-volume manufacturing. Future 3D memory devices will include multiple
economy of $2.3T. Jim Koonmen, SVP & GM of Brion at ASML, brought us closer to home with the industrialization of new lithographic technologies. From a litho perspective, the “small knob” is not broken; device shrink is still a driver. Single