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Imec is slated to install ASML's NXT 1950i 193nm immersion litho tool, and eventually will upgrade its current ASML NXE:3100 ..... leadership and commercial success." Among their collaborative litho work already bearing fruit are new sensors to help calibrate
and dose modulation; advanced e-beam modeling with arbitrary point spread functions for exploration; interactive aerial litho simulation from hardware acceleration; 5 × 5µm (on wafer) interactive mask-wafer double simulation; and SEM interface
and dose modulation; advanced e-beam modeling with arbitrary point spread functions for exploration; interactive aerial litho simulation from hardware acceleration; 5 x 5m (on wafer) interactive mask-wafer double simulation; and SEM interface for
down to double density each generation. For 22nm and trigate, litho challenges are similar to what you'd have in other architectures ..... session at The ConFab to demonstrate the interconnectivity of litho , wafer processing, and metrology challenges, as well as the
Lithography light source maker Gigaphoton Inc. opened its new U.S. Regional Headquarters and Training Center in Beaverton, OR.
Franklin Kalk, Toppan Photomasks, covers the major lithography demands of distinct semiconductor technologies: Logic, Flash, and DRAM. He also gives an update on fabless/foundry options, and Japan's earthquake recovery.
CEA-Leti's Serge Tedesco and Didier Louis summarize key themes from the Sokudo lithography breakfast forum held last week at SEMICON West.
Doug Anberg, VP of advanced stepper technology at Ultratech, discusses the physics behind improvements in the company's new Sapphire 100E HB-LED tool in a video interview at SEMICON West 2011.
Ushio Inc. debuted a 200mm wafer full-field projection lithography tool UX4-3Di FFPL 200 for high-volume manufacturing of advanced LSI devices incorporating 3D integration technologies, such as TSVs and silicon interposers and bumps.
Two TechXPOT sessions at SEMICON West will address the new architectures needed to continue scaling both logic and memory devices, as well as the major challenges facing lithography both for EUV and options for extending 193nm immersion.