Lead-Frame
Lead-Frame news and technical articles from Solid State Technology Magazine. Search Lead-Frame latest and archived news and articles
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Technic Pd/Ni process eliminates free ammonia in leadframe fab
… that produces low-stress ductile deposits over a wide current density range, for structures like semiconductor package leadframes . The Pallaspeed Pd/Ni NFA process eliminates free ammonia, improving worker and environmental safety (environment, health …
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Henkel develops die attach film for leadframe packages
… with extremely small dimensions into leadframe packages . The die placement process ..... with Henkel to increase workability in leadframe packaging (over die attach pastes ..... applications. With the Ablestik product, one leadframe design to be used for multiple package …
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Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive components
… METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications. The product is solvent-free, meeting NASA outgassing specification. It is also non-bleeding and …
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The search for a "super QFN" package
… interconnect. A partial leadframe sheet of 32 I ..... limitations with leadframes . Table 1 summarizes ..... of conventional leadframes . QFNs have dominated ..... imposed by the leadframe have prevented ..... superior to the lead frame technology. Both …
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Henkel debuts automotive sensor packaging adhesive
… bond components to metal leadframes in plastic housings. The ..... components are bonded to metal leadframes inside plastic housings ..... the component and the leadframe . Also read: Henkel develops die attach film for leadframe packages The adhesive …
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Driving down HB-LED package costs
… point at the end. A few years ago HB-LED packages were assembled from many discrete parts. These included a metal lead frame , a molded pocket for the LED, a zener diode, a mirror coating for the pocket, a heat sink for the LED, wire bonds …
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Asia package test house selects Multitest equip for MEMS test
… equipment. Multitest states that InCarrier overcomes strip test constraints with respect to singulation after test and lead frame design, and offers combined benefits of singulated package and parallel testers. The products also handle 2 x 2mm packages …
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IC packaging substrates heading for $8.67B in 2012
… IC Substrate Industry Report, 2011-2012.” As IC operating frequencies improve and integration increases, traditional leadframe packaging is giving way to substrate-based semiconductor packaging , such as ball grid array (BGA), chipscale packages …
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Thailand flood update from key semiconductor assembly and test companies
… supplier of a key component used for semiconductor assembly has been impacted: leadframe maker Sumitomo Thailand. Sumitomo Thailand has stopped supplying leadframes from its Thailand facility to TI. However, Sumitomo has other operations and …
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Copper pillars appear in packages from Amkor to Unisem, says Vardaman
… pillar bumps for more than four years. Drivers included size, performance, and cost. Copper pillar is also shipping in leadframe packages from companies including Carsem and Unisem. IBM developed a copper pillar process called C2 that has been introduced …
