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August 17, 2011 -- The annual Known Good Die (KGD) conference will address semiconductor die testing ..... options and infrastructure. For more information on the Known Good Die conference, visit: http://meptec.org/meptecknowngoodd
TEST METHODS AND RELIABILITY SCREENS BY LARRY GILG The term “ known good die ” (KGD) has always generated more heat than light. The original intent of the phrase was to signify that bare die or unpackaged
as the use of unpackaged semiconductor devices becomes more widespread, the need for the reliable availability of known good die (KGD) becomes increasingly important. In essence, KGD are unpackaged die that offer equivalent reliability levels
September 1, 2010) -- The 17th Annual International KGD ( Known Good Die ) Packaging and Test Workshop 2010 will focus on semiconductor ..... of the ITRS Roadmap Committee, will present on “ Known Good Die in the Era of Deep Submicron and 3D Integration
DELIVERING TRUE KNOWN GOOD DIE BY JOHN PITTS The average person will encounter more than 300 embedded ..... applications alone, according to Strategy Analysts, putting production of known good die (KGD) at the forefront of the demand spectrum. Figure 1. Expanded
tomorrow’s high-performance ICs,” said Tim Mobley, CEO at Triton. “Our technology allows us to achieve known - good - die testing at the highest levels of packaging integration, faster cycle times and the lowest cost per unit in the market
will be adding a 3D test table (the visual layout for what processes need work), with the hope of better managing known good die (KGD) going into die stacks, and fault-tolerant devices. It is very easy to lower yields and lose money by scrapping
concept test cell solution will be designed for die handling, test, and production line integration. From wafer to known good die (KGD) and known good stack (KGS), the DIMENSION concept shows the direction of 2.5D and 3D production-capacity
dedicated test solutions for foundry customers. Foundry customers using ams’ IC test solution service will receive known good die (KGD) , with their complex analog/mixed-signal ICs 100% electrically tested according to their own test specification
interconnects is another major topic. Testing issues include the combination of internal and third-party silicon and known good die (KGD). The November 10 conference, "KGD in an Era of Multi-Chip Packaging and 3D Integration," will focus