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Kgd news and technical articles from Solid State Technology Magazine. Search Kgd latest and archived news and articles

  1. KGD Packaging and Test Workshop keynote, panel on TSV, and more

    Online Articles

    Wed, 1 Sep 2010

    2010) -- The 17th Annual International KGD (Known Good Die) Packaging and Test Workshop ..... this year is “Challenging Issues for KGD as the Industry Moves to Finer Geometries ..... panel will explore a related topic of “Is KGD Required for TSV ?” moderated by Jan Vardaman

  2. ams offers foundry customers KGD with enhanced IC test

    Online Articles

    Mon, 11 Jun 2012

    test solutions for foundry customers. Foundry customers using ams’ IC test solution service will receive known good die ( KGD ) , with their complex analog/mixed-signal ICs 100% electrically tested according to their own test specification. The electrical

  1. KGD MEETING REPORT

    Magazine Articles

    Sat, 1 Dec 2001

    SIPs at forefront of KGD Packaging and Test Workshop BY LARRY GILG ..... Eighth Annual International Known Good Die ( KGD ) Packaging and Test Workshop held in Napa ..... addition to the traditional emphasis on KGD test and reliability conditioning for ICs

  2. Antares Presents Spring-pin Test at KGD

    Online Articles

    Thu, 6 Sep 2007

    VANCOUVER, WA Antares Advanced Test Technologies will detail wafer-level testing possibilities with small-pitch spring pins at the 2007 KGD Packaging & Test Workshop on September 11. The workshop will take place September 9 12 in Napa, CA.

  3. Full Wafer Contact Technology: A KGD Enabler

    Magazine Articles

    Wed, 1 Dec 2004

    putting production of known good die ( KGD ) at the forefront of the demand spectrum ..... technology* has been developed to enable KGD microcontrollers for the automotive industry ..... only a few processes that can deliver true KGD . Statistical good die selection, test

  4. TSV probe partnership Cascade Microtech imec collaborate for kgd

    Online Articles

    Thu, 3 Mar 2011

    for mobile advanced devices like tablets and smartphones. Chip stacking with 3D-TSV interconnects requires known good die ( KGD ) wafer probing with high test coverage before stacking to achieve practical stack yields. The high density of TSV interconnects

  5. KGD test/ handling

    Magazine Articles

    Sat, 1 Aug 1998

    KGD test/handling The MP650 combines automatic bare die handling with multiple ..... pack trays, bulk bins, or reconstructed wafer with 100% known good die ( KGD ). The die are selected automatically via vision (ink dot rejection) or by

  6. Die-attach Paste Offers Self-filleting, KGD Bonding

    Online Articles

    Fri, 28 Aug 2009

    Debbie Forray and Ilya Furman, Henkel Corp., compare a self-filleting die attach paste to film-based adhesives. Semiconductor companies are seeking lower-cost die attach material solutions to replace the higher-cost, film-based adhesive materials used for certain applications. One such material is

  7. System-in-Cube Technology Addresses Parasitics, KGD

    Online Articles

    Tue, 6 Mar 2007

    (March 7, 2007) COSTA MESA, CA Irvine Sensors Corporation demonstrated its 3D packaging technologies to stack four 500-mHz DDR memory chips without operating-speed degradation, which was verified by the chip maker. The company will now explore commercial exploitation of packaging techniques for

  8. Process and handling challenges for known good die

    Magazine Articles

    Mon, 1 May 2000

    the need for the reliable availability of KGD becomes increasingly important. In response ..... the reliable availability of known good die ( KGD ) becomes increasingly important. In essence, KGD are unpackaged die that offer equivalent reliability

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