Ion Etch
Ion Etch news and technical articles from Solid State Technology Magazine. Search Ion Etch latest and archived news and articles
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AMEC reactive ion etch tool enables sub-28nm nodes
… Fabrication Equipment Inc. (AMEC) launched its Primo second-generation 300mm very-high-frequency advanced decoupled reactive ion etch (AD-RIE) tool for sub-28nm critical process requirements. The wafer processing tool has an advanced RF system for process …
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DRIE expands from MEMS to advanced packaging and more applications
May 15, 2012 -- Deep reactive ion etching (DRIE) is a structuring process originally used to make micro electro mechanical systems (MEMS) . This process enables achieving …
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Dolomite, LioniX partner on microfluidics design, manufacturing, more
… combine their microfluidics and microfabrication expertise, offering a range of innovative processes such as deep reactive- ion etch (DRIE) of fused silica down to an etch depth of 500um, plasma-enhanced chemical vapor deposition (PECVD) of silicon …
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Micrel MEMS fab graded 98% following multi-million-dollar expansion
… fab ramp up , initiating 3D front-to-back wafer alignment capability and acquiring a state-of-the-art deep reactive ion etch (DRIE) tool to fab very deep trenches, through silicon vias (TSV), and large cavities required in MEMS designs. The …
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MIT designs completely 3D MEMS
… Fachin says, fabricating 3-D devices in silicon is tricky. MEMS engineers use a common technique called deep reactive ion etching to make partially 3-D structures, in which two-dimensional elements are etched into a wafer. The technique, however …
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MEMS to see higher penetration in diverse applications through 2017
… gain in significance with the gradual commoditization of MEMS devices. MEMS manufacturing technologies like deep reactive ion etch (DRIE) and other process technologies in production and wafer-level bonding for MEMS packaging will positively benefit …
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AMEC debuts TSV etch tool with Chinese installations
… three dual-station process modules. An RF pulsing bias capability eliminates profile notching. Also read: AMEC reactive ion etch tool enables sub-28nm nodes AMEC claims a 30% capital-efficiency premium over other available TSV etchers. The system …
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UNL taps SEMI-GAS for semiconductor metrology lab’s gas needs
… high-purity single-wall and coaxial gas lines from the source systems to their designated points-of-use: a reactive ion etch and krypton fluoride laser, among other tools. With the equipment installed, certified technicians from Applied Energy Systems …
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Tegal sells deposition patents
… physical vapor deposition (PVD) product lines to OEM Group, Inc. of Gilbert AZ, and in February 2011, sold its deep reactive ion etch (DRIE) assets to SPTS of Newport, Wales, UK. Tegal Corporation enables emerging technologies in microprocessors, advanced …
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Si-Ware platform creates MOEMS on-wafer with lithographic alignment
… Multiple optical MEMS (MOEMS) structures can be patterned and etched on silicon on insulator (SOI) wafers using deep reactive ion etching (DRIE) . The structures are then wafer-level packaged and diced to create a one-chip optical system. SiMOST eliminates …
