Interconnects
Interconnects news and technical articles from Solid State Technology Magazine. Search Interconnects latest and archived news and articles
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Enphase Energy microinverter features easy-install Engage cabling system
Enphase Energy released the 215-Series Microinverter, with a 25-year limited warranty and proprietary cabling system called Engage System. The series begins with the standalone 215Wac M215 Microinverter.
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Korean IDM orders NEXX tools for WLP metallization
NEXX Systems installed 2 300mm Stratus deposition at a Korean IDM for high-volume wafer-level packaging processes.
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PV ribbon-attach conductive adhesive from ECM suits Sn, SnAg, Ag
Engineered Conductive Materials LLC launched the DB-1538-2 conductive stringer attach adhesive with reported low bleed on TCOs and a wide operating temperature range.
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TSV moves to "real engineering," but reliability data needed
Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.
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Power management ICs for green energy applications
Executive Overview The power management IC (PMIC) has become a critical component in virtually every electronics product today. Much of this demand is being fueled by the global transition to green energy solutions. Highlighted will be a 0.18m BCDMOS process with 30V LDMOS transistors having an Rsp
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One year later: Amkor/TI high-density copper pillar bump technology
In late June 2010, Amkor and TI announced that they had qualified and begun production of the industry's first fine pitch copper pillar flip chip packages—shrinking bump pitch up to 300% compared to then current solder bump flip chip technology.
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Inside Leti: FDSOI, 3D packaging, Si photonics work
Laurent Malier, CEO of Leti, described the research group's work and the outlook on fully depleted silicon on insulator (FDSOI), 3D packaging technologies, and integrated photonics on silicon.
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IEEE Photonics conference highlights lasers, LEDs, optical communications, sensors, displays and more
The IEEE Photonics Conference 2011, previously known as the IEEE LEOS Annual Meeting, will offer more than 550 technical presentations by the world’s leading scientists and engineers in the areas of lasers, optoelectronics, optical fiber networks and associated lightwave technologies, as well as ...
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Power semiconductor packaging drops wire bonding for sintered foil
Semikron developed a power semiconductor packaging technology, SKiN, which uses flexible foil and sintered interconnects instead of bonding wires, solders, or thermal paste.
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Quantum dot laser grown on silicon substrate, suits telecom
UCL and the London Centre for Nanotechnology researchers have demonstrated an electrically driven, quantum dot laser grown directly on a silicon (Si) substrate, with a 1300nm wavelength suitable for telecommunications electronics.
