Interconnect
Interconnect news and technical articles from Solid State Technology Magazine. Search Interconnect latest and archived news and articles
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Tessera interconnect platform targets limitations
… Inc., launched an interconnection platform intended to ..... products. The µPILR interconnect platform ¿ which stands for micro pin interconnect layer ¿ involves ..... the next step in the interconnect evolution of advanced …
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SEMICON WEST REPORT: Interconnect symposium heralds exciting year
… Vardaman concluded. Other Interconnect Symposium presenters included ..... stacked die packaging and interconnect schemes. Carson says we ..... years out. All levels of interconnection integrated together will ..... v.T. The SEMICON West Interconnect Symposium presentations …
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IPC, Jisso Sponsor Advanced Interconnect Seminar
… sponsoring a technical seminar, "Implementing Advanced Interconnect Technology Solutions," May 21–22, 2008, in Atlanta ..... the event will provide information on the latest trends in interconnection technologies, led by speakers from JIC and the industry …
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Tessera Interconnect Platform Targets Limitations
Tessera Technologies, Inc., launched an interconnection platform intended to address technical limitations of current-generation packaging technologies, such as pitch, profile, performance …
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Adhesive Interconnect Flip Chip Assembly
… in isotropic conductive adhesive assembly for flip chip interconnection . Originally found principally in low bump count and low ..... adhesive attachment. Although direct gold-to-gold interconnection , with no adhesive, is a reliable flip chip technique …
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UCLA scientists interconnect nanoscale devices with "spin-wave buses"
… transfer for information exchange, and shows significant interconnection problems, the UCLA scientists claim. The first device ..... reduction in power consumption and provides a high level of interconnectivity between many more paths than currently possible. The device …
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Alchimer to collaborate with imec on advanced nano-interconnect technologies
… processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs ..... and implement copper filling solutions for advanced nano- interconnect technologies. The focus of the project will be on Alchimer …
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Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. Yole Développement’s investigation aims at providing statistical analysis of existing IP to give …
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Technologists Investigate Challenges for 3D Interconnect Metrology
… enhanced to measure and improve 3D interconnect processes, SEMATECH will host a workshop dedicated to 3D interconnect metrology on July 15 in conjunction ..... share real metrology results from 3D interconnect processing, discuss metrology challenges …
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Air gaps lower k of interconnect dielectrics
Air gaps lower k of interconnect dielectrics Ben Shieh, Krishna ..... between metal lines to lower the k of interconnect dielectric stacks. Design constraints ..... Manufacturable processes can reduce interconnect capacitance by as much as 40 …
