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(February 20, 2008) Genoa, NV Techcet Group LLC reports the market for interconnect metals and dielectric materials, totaling $350 million in 2007, is maintaining its lead as the highest growth area compared to other semiconductor process materials. The latest edition of the Techcet report ...
propagation delays associated with interconnects begin to bottleneck the operating speeds of transistors. New interconnect materials are needed to reduce the RC time constant associated with the delays. While integrating copper metallurgy in
At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.
(May 02, 2005) Chungli, Taiwan—More details are available today from ASE Inc. about yesterday's fire at its Chungli, Taiwan facilities. The first 4 floors of the 11-floor building that housed part of ASE's operations for the production of interconnect materials were badly damaged. Most of the ...
looking for commercialization opportunities. The solder offers reliability and cost improvements over current interconnect materials , according to Lin Kwang-lung, professor of materials science and engineering at NCKU. Industry partners are
s approach is an array of MEMS parallel plate capacitor tunable over a wide range using conventional CMOS interconnect materials built atop a 4LM CMOS circuit. The infamous ‘Antennagate’ episode brought to light by the iPhone
roadmaps for system-level electronics manufacturing, on this initiative. Paul Zimmerman (Intel), speaking on interconnect materials , reiterated the idea that traditional scaling is slowing, and can only go so far. This is an opportunity for
backside firing paste. To date, the dominant interconnect materials used to make these copper ribbon connections ..... cannot withstand. At the same time, these new interconnect materials must be as effective a conductor as solder and
August 26, 2011 -- Engineered Conductive Materials LLC, conductive interconnect materials supplier for photovoltaic applications, debuted the DB-1580 Series Conductive Stringer Attach Adhesives for back-contact crystalline
August 15, 2011 -- Engineered Conductive Materials LLC, conductive interconnect materials supplier, introduced CI-1083-L and CI-1081-H conductive grid inks for thin-film solar modules. They are optimized for