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Interconnect Materials

Interconnect Materials news and technical articles from Solid State Technology Magazine. Search Interconnect Materials latest and archived news and articles

  1. Complex Integration Spurs Growth in Interconnect Materials Market

    Online Articles

    Wed, 20 Feb 2008

    (February 20, 2008) Genoa, NV Techcet Group LLC reports the market for interconnect metals and dielectric materials, totaling $350 million in 2007, is maintaining its lead as the highest growth area compared to other semiconductor process materials. The latest edition of the Techcet report ...

  2. A new class of insulating materials: Emergence of ultralow- k

    Magazine Articles

    Sat, 1 Sep 2001

    propagation delays associated with interconnects begin to bottleneck the operating speeds of transistors. New interconnect materials are needed to reduce the RC time constant associated with the delays. While integrating copper metallurgy in

  1. 22nm requires foundry-to-packaging-house cooperation

    Online Articles

    Fri, 30 Dec 2011

    At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.

  2. ASE Investigates Cause of Fire at Chungli, Taiwan Facilities

    Online Articles

    Mon, 2 May 2005

    (May 02, 2005) Chungli, Taiwan—More details are available today from ASE Inc. about yesterday's fire at its Chungli, Taiwan facilities. The first 4 floors of the 11-floor building that housed part of ASE's operations for the production of interconnect materials were badly damaged. Most of the ...

  3. ASE tests NCKU lower-cost packaging solder as better than SAC

    Online Articles

    Thu, 9 Aug 2012

    looking for commercialization opportunities. The solder offers reliability and cost improvements over current interconnect materials , according to Lin Kwang-lung, professor of materials science and engineering at NCKU. Industry partners are

  4. Conference report: MEMS Business Forum

    Online Articles

    Fri, 25 May 2012

    s approach is an array of MEMS parallel plate capacitor tunable over a wide range using conventional CMOS interconnect materials built atop a 4LM CMOS circuit. The infamous ‘Antennagate’ episode brought to light by the iPhone

  5. Roadmapping More than Moore: When the application matters

    Online Articles

    Fri, 13 Jul 2012

    roadmaps for system-level electronics manufacturing, on this initiative. Paul Zimmerman (Intel), speaking on interconnect materials , reiterated the idea that traditional scaling is slowing, and can only go so far. This is an opportunity for

  6. Reducing cost/improving efficiency in solar modules

    Magazine Articles

    Wed, 1 Sep 2010

    backside firing paste. To date, the dominant interconnect materials used to make these copper ribbon connections ..... cannot withstand. At the same time, these new interconnect materials must be as effective a conductor as solder and

  7. Back-contact PV conductive adhesives offer cure options

    Online Articles

    Fri, 26 Aug 2011

    August 26, 2011 -- Engineered Conductive Materials LLC, conductive interconnect materials supplier for photovoltaic applications, debuted the DB-1580 Series Conductive Stringer Attach Adhesives for back-contact crystalline

  8. Thin film PV benefits from conductive grid inks from ECM

    Online Articles

    Mon, 15 Aug 2011

    August 15, 2011 -- Engineered Conductive Materials LLC, conductive interconnect materials supplier, introduced CI-1083-L and CI-1081-H conductive grid inks for thin-film solar modules. They are optimized for

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