Interconnect Layer
Interconnect Layer news and technical articles from Solid State Technology Magazine. Search Interconnect Layer latest and archived news and articles
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IEDM 2010: Inside Renesas' eDRAM structure
… storage elements in DRAM, in the interconnect layer used for the logic circuits ..... cylindrical capacitors in the interconnect layer instead of forming a layer independent of the interconnect layer , this new technology obviates …
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JEDEC updates Flash memory standard for tablet/smartphone reqs
… efficient data transport, JEDEC UFS aligns with industry-leading specifications from the MIPI Alliance to form its Interconnect Layer . This collaboration continues with UFS v1.1, which supports the M-PHY and UniPro specifications. Recently …
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Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest
… Technology 5) -- a five-layer polycrystalline silicon surface micromachining process (one ground plane/electrical interconnect layer and four mechanical layers). Designs were then shipped back to the university students to test whether the final …
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New 300mm TSV production processes aim of SPTS, CEA-Leti partnership
… TSV technology is quickly gaining industry prominence as this method of 3D integration facilitates a thinner interconnect layer between stacked devices, allowing higher density interconnectivity to produce better electrical performance, all …
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EU group takes stride toward optical interconnects
… is to devise, build, and demonstrate a photonic interconnect layer on CMOS with optical interconnects capable of handling ..... Final deliverables are pledged to be: a photonic interconnect layer with multichannel microsources, microdetectors …
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EU group takes stride toward optical interconnects
… is to devise, build, and demonstrate a photonic interconnect layer on CMOS with optical interconnects capable of handling ..... Final deliverables are pledged to be: a photonic interconnect layer with multichannel microsources, microdetectors …
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Intel packaging technology aims to enable 20-GHz processors by 2006
… package core and only the lower interconnect layer needs to be built up, according ..... require C-4 bumps or a top interconnect layer . However, there is still a need for the bottom interconnect layer , which attaches the pins to …
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Technology News
… routing lines in a single interconnect layer on complex, cell-based ASIC ..... about an hour or two/metal interconnect layer in structured ASICs, says ..... estimates as up to $30,000 for interconnect - layer masks in advanced processes …
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IMEC: Double-patterning immersion works for 32nm
… uses Cu plating in a photoresist pattern to achieve a small linewidth, enabling a high-density high-current interconnect layer . The contacts through the 2µm thick IC passivation have a diameter of only 3µm, with "very good contact resistance …
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Intel at IEDM: 45nm HK+MG, variation mitigation, Moore's Law beyond 2015
… rectangular or round contacts, as well as lead-free packaging. The redistribution layer, i.e., the 9th interconnect layer , is "very" thick, allowing for "very nice" on-die power distribution, Mistry told WaferNEWS . "The redistribution …
