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Exhibition attracts professionals from industry, academia, and national laboratories in semiconductor processing, interconnect design , and equipment development. Conference topics include both fundamental and applied research, as well as issues
for compatibility with porous SiOCH materials. Ron Ho of Oracle's Sun Labs talked quite enthusiastically about interconnect design considerations for multi-core processors. The underlying goal is to make off-chip I/O as inexpensive and
being forced further into the realm of high density interconnect . Design techniques and substrates labeled exotic only a ..... removes much of the uncertainty of high density interconnect design , allowing design teams to take full advantage
efforts have given rise to a fundamentally different approach to interconnect design , the X Architecture. Jointly developed by Toshiba Corp ..... focus on removing barriers to adopting this new approach to interconnect design . R.D.
efforts have given rise to a fundamentally different approach to interconnect design , the X Architecture. Jointly developed by Toshiba Corp ..... to focus on removing barriers to adopting this new approach to interconnect design .
mask (TFHM) approach, optimizing bond pad and interconnect design rules, and careful attention to assembly techniques ..... found that optimization of bond pad design and interconnect design rules must consider the stress distributions associated
(May 15, 2007) SAN JOSE, CA Cadence Design Systems, Inc., released product and technology enhancements within its Allegro system interconnect design platform for PCB design, including constraint-driven flow and global routing.
April 26, 2006 - Cadence Design Systems Inc., San Jose, CA, is releasing a revised system interconnect design platform to simplify and streamline designs for printed circuit boards, extending a "segmented" product strategy already used
Rajeev Bajaj explained that eSQ allows planarizing contact at the die level, enabling precise control that meets interconnect design tolerance for dishing and erosion for 45nm process manufacturing. The system's 3D design helps eliminate "edge
can become a viable solution to achieve higher memory capacities in industry-standard form factors, but new interconnect design concepts are needed. The stacking overhead must be kept to a minimum so module sizes comply with JEDEC standards