Interconnect Applications
Interconnect Applications news and technical articles from Solid State Technology Magazine. Search Interconnect Applications latest and archived news and articles
-
While AMAT plugs a hole in the ALD market, Genus stands its ground
… deposition) at SEMICON West, essentially targeting interconnect applications . Genus, however, has been offering an ALD ..... for all these processes, whereas the broader interconnect applications , which may include copper, will come later …
-
IITC PREVIEW: CNT interconnects target 32nm
… potentially beyond that of copper. Much attention has been focused recently on replacing copper with CNT bundles for interconnect applications , given CNTs' excellent electrical properties. They are among the few materials that could exceed the 1x10 7 …
-
Product News
… www.viscom.com. Tunable Cu CMP system The ACuPLANE copper barrier CMP system for advanced Cu/low- k interconnect applications combines Rohm and Haas’s EcoVision 4000 CMP Pad and ACuPLANE 5000 Series slurries. This tunable CMP system …
-
Parylenes for flexible electronics and display applications
… 7555, 1999. A.S. Harrus et al., “Parylene AF-4 low- k Material Candidate for ULSI Multilevel Interconnect Applications ,” MRS Symp. Proc. Vol. 443, p. 21, 1997. M.A. Plano et al., “The Effects of Deposition Conditions …
-
System-in-package integration of passives using 3D through-silicon vias
… etc.) and shows that paste printing may soon be a potential low-cost alternative for less-critical via interconnect applications . Further analysis on chain structures of these vias is ongoing. Conclusions We have investigated a few technology …
-
Applications of spin-on hybrid BARCs for FEOL and BEOL integration
… photoresist in ArF applications. The hybrid BARC has also demonstrated use in both blanket film applications and interconnect applications where via-fill and planarization are required. In addition, extended shelf life and stable film properties …
-
Semitool's Packaging Presentation… It's gonna talk about through silicon and I can do it in packages she's currently the director of 3-D interconnect applications semi tool. Leading global in the product management marketing efforts within 3-D interconnect business unit …
I can do it in packages she's currently the director of 3-D interconnect applications -- semi tool. Leading global in the product management marketing efforts within 3-D interconnect business unit I think that was a little -
Process monitoring and surface characterization with in-line XPS metrology
… silicon surface for the source/drain implantation process, and fluorine contamination of a TiN hard mask for interconnect applications . Advanced CMOS technologies of 65nm and below are increasingly sensitive to process variations. Additional challenges …
-
Nanomaterials Promise Innovative Solutions
… temperature assembly opportunities. Non-conductive adhesives such as underfills can be used in die attach and other interconnect applications . Shrinking the polymer pulls the bump towards the pad. Unfortunately, the conventional 500-nm-size …
-
Laser Applications in Advanced IC Packaging
… integration of TSV can be realized. Conclusions While lasers have been used for various device packaging and interconnect applications , 4 the advent of CSP with TSV architectures represents an opportunity to bring laser processing into the forefront …
