Interconnect Applications
Interconnect Applications news and technical articles from Solid State Technology Magazine. Search Interconnect Applications latest and archived news and articles
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Novellus tips WN film for 3X memory Cu interconnects
Novellus says it has devised a new process technology for tungsten vias for copper interconnect applications in 3X node and below memory devices. The "DirectFill" chemical vapor deposition (CVD) tungsten nitride (WN) liner-barrier …
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Optomec aerosol jet printing featured as wire bond, TSV alternative at IMAPS Device Packaging
… will give a presentation titled "Aerosol Jet Printing as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications " at the IMAPS (International Microelectronics and Packaging Society) Device Packaging Conference on March …
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Optimized bath control for void-free copper deposition
… plating bath for copper interconnect applications is achieved by careful ..... filling in advanced Cu interconnect applications [1, 2]. Organic additives ..... plating bath for copper interconnect applications is achieved by careful …
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More SEMICON West exhibit previews
… Jet system can be used to produce high-conductivity adhesive features for surface mount and high-stress interconnect applications . Aerosol Jet technology can print a wide variety of electronic materials directly onto a wide variety on non …
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Novellus tips WN film for ≤3X memory Cu interconnects
May 10, 2010 - Novellus says it has devised a new process technology for tungsten vias for copper interconnect applications in 3X node and below memory devices . The "DirectFill" chemical vapor deposition (CVD) tungsten nitride …
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FEI eyes 3D structures with integrated SEM/FIB platform
… materials science R&D. Figure 1. TSV and interconnect applications . (Source: FEI Co.) Key to the system ..... coincident WD. Through-silicon vias (TSV) and interconnect applications are challenging because of the increased milling …
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Electromigration improvement for advanced technology nodes
… On the Use of Alloying Elements for Cu Interconnect Applications ," J. Vac. Sci. Technol. B , Vol. 24 ..... Wu, et al., "Ti-based Barrier for Cu Interconnect Applications ," Proc. of the IITC , p. 202, 2008 …
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MRS Day 4: TSVs and CMOS+MEMS, wafer bonding, CNT interfaces, ALD for rare-earth HK, graphene redux
… and DC testing modes. F10.4 . Bin Yu at Albany CNSE investigated some key reliability limits for on-chip interconnect applications of multilayer graphene systems. The mobility of graphene is 20× higher than Si and its thermal conductivity …
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FEI eyes 3D structures with integrated SEM/FIB platform
… their surface sensitivity. Figure 1. TSV and interconnect applications . (Source: FEI Co.) The XHR SEM imaging ..... coincident WD. Through-silicon vias (TSV) and interconnect applications are challenging because of the increased milling …
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Implications of damascene topography for electroplated copper interconnects
… advantageous for submicron interconnect applications . In the absence of additives ..... of electroplating for interconnect applications [2, 3]. Cross-section ..... The plating baths for interconnect applications currently include a combination …
