Inspection
Inspection news and technical articles from Solid State Technology Magazine. Search Inspection latest and archived news and articles
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JEDEC revises package inspection standard JESD9B
The JEDEC Solid State Technology Association published a significant revision to JESD9B, Inspection Criteria for Microelectronic Packages and Covers.
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CMP consumables are back faster than expected
The global CMP consumables market recovered from the recession, 2 years ahead of schedule. According to Techcet Group's "CMP Consumables 2011 Critical Materials Report," market share is shifting from W and ILD slurry to copper and STI, and fabs are establishing "magic triangles."
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DCG Systems acquires Thermosensorik, accesses new customer sectors
DCG acquired Thermosensorik GmbH, a leading provider of infrared non-destructive testing (IR NDT) products for the semiconductor, photovoltaic, and weld inspection markets.
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Olympus inspects bonded wafers with IR microscopy
Greg Baker, Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on IR metrology for defect inspection of bonded wafers. Olympus-ITA launched the latest 3DIR Metrology and Defect Review System at SEMICON West 2011, booth 1524.
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Extending optical lithography with complementary e-beam lithography
David Lam summarizes how the industry does not have to "throw out" optical lithography as it proceeds to more advanced nodes -- complementary e-beam lithography (CEBL) is part of the overall solution, "complementary lithography," that can overcome the resolution limitations of 193i technology.
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AMEC reactive ion etch tool enables sub-28nm nodes
AMEC launched its Primo 300mm very-high-frequency advanced decoupled reactive ion etch tool for sub-28nm. AMEC's Ben Lee describes the tool's mini-batch cluster architecture, and the physics that makes it work.
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Gold wires go brittle at nanoscale
Gold wires are used in electronic devices due to the material's flexiblity and conductive quality. At the nanoscale, however, gold wires (
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FEI plasma FIB tool suits MEMS, 3D packaging
FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.
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Metryx joins semiconductor equipment assessment group SEAL
Metryx will work with IMEC and Intel via the joint European Semiconductor Equipment Assessment Leveraging Innovation (SEAL) project to assess high-resolution mass metrology viability at 20nm and smaller nodes.
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Proper PV labeling: How to install a PV system that meets IFC/NEC labeling standards
Todd Fries, HellermannTyton, describes recent fire and electrical codes that affect solar photovoltaics (PV) installations, debunking some myths and describing what installers need to know to pass inspection and properly label PV systems.
