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deal to integrate Rudolph Technologies' lithography inspection technology in its coater/developer tools, with worldwide distribution ..... also addresses "possible next-generation integrated inspection technologies ."
Advanced Technology Program (ATP) has awarded $13.7 million in funding for a project to develop advanced wafer inspection technology for next-generation lithography (NGL) applications at the 50-nm and 70-nm nodes. A team of researchers
of several different inspection technologies in a single tool ( Table ..... Combining multiple inspection technologies enables more accurate ..... undetected using one inspection technology can be found by other ..... combination of different inspection technologies makes sense only if
of several different inspection technologies in a single tool ( Table ..... Combining multiple inspection technologies enables more accurate ..... undetected using one inspection technology can be found by other ..... combination of different inspection technologies makes sense only if
oxide CMP tool. Multiple inspection technology strategy To tailor an inspection ..... employ several different inspection technologies . This mix of inspectors ..... required [6]. This multiple inspection technology strategy preserves the balance
Defect inspection technologies to meet the challenges of advanced CMP processes James Reynolds, Reynolds Consulting, Sunnyvale, California Aaron L. Swecker
Not all packaging and interconnect defects can be detected through in-circuit and functional test.
November 28, 2001 -- SAN JOSE, CA -- KLA-Tencor Corp. recently announced that Texas Instruments (TI) has placed a follow-on order for KLA-Tencor's 2350 ultraviolet (UV) inspection system. This order is a result of the critical role the 2350 system is playing in the rapid ramp of TI's first 300 mm
November 29, 2010) -- The phoenix nanotom m, from GE´s Inspection Technologies business , has been developed for high resolution and ..... said Oliver Brunke, product manager for CT at GE’s Inspection Technologies business. nanoCT of through-silicon-vias (50µm
wafers, necessitates the integration of inspection in de-bonding applications. Rudolph is bringing its inspection technologies to this three-way collaboration to provide this integrated process control solution. The first two revenue