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The main scaling goal for high-performance logic is to maximize speed; for low-power logic, it is to maintain low leakage currents.
Sept. 8, 2004 - The Defense Advanced Research Projects Agency (DARPA) has awarded a $9.5-million contract to a team led by Lucent Technologies to develop a MEMS-based system that would enable faster and cheaper fabrication of integrated circuits, according to a news release. The four-year contract,
DuPont Integrated Circuit ( IC ) Fabrication Materials. "Today, we are extending ..... advanced materials segment of IC fabrication ," said David B. Miller, vice ..... extend the strategy to grow our IC fabrication materials portfolio within DuPont
manufacturers have leveraged equipment designed for IC fabrication , and this article reviews the impact on equipment ..... that these commonalities lend themselves to adapting IC fabrication process tools to TFH applications, thereby gaining
lithography tutorial "The F & F IC Fabrication & Lithography Tutorial" is a ..... enhancing their understanding of the IC fabrication process. The program reviews ..... interprets industry trends; describes IC fabrication ; discusses the lithographic process
August 30, 2005 - AMI Semiconductor has renewed its partnership with MOSIS, a prototype and low volume production IC fabrication service, to participate in the MOSIS multi-project wafer (MPW) program and MOSIS education program (MEP
State Technology Editor Advisory Board Member We are entering a new era, in which nano-fabrication is moving beyond IC fabrication . Chasing Moore's Law is still an important challenge, but there are now other interesting challenges. Making
damascene built at TI Texas Instruments (TI), Dallas, TX, has announced a viable copper wiring technology for IC fabrication . TI joins the ranks of IBM and Motorola, which have both made early introduction of "copper technology" a marketing
Instruments Inc., M.E. Bran, Verteq Inc. The net manufacturing cost of silicon die dominates the economics of IC fabrication . The industry relentlessly pursues robust, massively parallel fabrication processes to drive the die cost down
manufacturers primarily use polished silicon wafers (PW) and epitaxial silicon wafers (epi) as the starting material in IC fabrication . Introduced in the early 1980s, epi provides electrical characteristics not available from standard PW, while eliminating