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  1. AVS Symposium 2011: A pre-show highlight reel

    Article

    Tue, 11 Oct 2011

    … 3D LSI; deep silicon etching with STiGer process; alternative passivation chemistries for TSVs; wafer-scale hermetic packaging for MEMS; Plasma etch challenges (profile control, feature level uniformity, plasma microdamage); a dry etching …

Related Topics:

  1. Mems Packaged
  2. Packaging
  3. Package Test
  4. Thin Package
  5. Mems Die
  6. System In Package
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