Gold Wire
Gold Wire news and technical articles from Solid State Technology Magazine. Search Gold Wire latest and archived news and articles
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Microbonds, Tanaka ink bonder deal
March 28, 2006 - Privately held Canadian interconnect developer Microbonds Inc. has licensed its "X-Wire" gold wire bonding technology for use in Tanaka Denshi Kogyo's line of gold bonding wire products, with an integrated product …
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K&S Sees Gold Gaining
(November 16, 2006) FORT WASHINGTON, PA In a corporate review to close fiscal 2006, Kulicke & Soffa outlined developments in gold bumping for stacked packages and upward trends for gold wire .
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Wafer Bumping for Flip Chip Attach
… bumping for flip chip attach, three of which are challenging and expensive: Stud bumps formed by ball bonding using gold wire ; plated gold bumps using electrolytic or electroless gold; and plating solder bumping by electrolytic or electroless …
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Contemporary semiconductor packaging experts open up on cost
… placed gas jets that create an inert atmosphere. They take regular cross sections of bonds, which was not necessary with gold wire . Chylak also pointed out that packaging houses should ramp up copper wire bonding with a “middle step” between tool …
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Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology
… improved to 3µm, and ASM's GoCU technology enables it to operate faster with lower-cost copper wire rather than with gold wire , maintaining accuracy. The Auto Wire Rethread System of the ASM iHawk Xpress ensures that the bonding wire is clamped …
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Carsem expands MLP/QFN capacity in Suzhou
… increased copper wirebonding, along with traditional gold wire bond. Several packaging houses are moving to copper wire ..... and low- k /extra low- k (ELK). Opponents consider gold wire to perform better than Cu wire, citing in-service product …
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NSMAT licenses Pd-coated Cu bonding wire to competitor
… packaging, thanks to a unique structural design. It also offers high electrical conductivity, more than 20% higher than gold wire . EX1 went into mass production in 2009 and claims more than 80% of the copper bonding wire market share. It has been …
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Amkor transitions PBGA packaging to pin-gate molding
… socket insertion and shipping. PGM uses higher density substrates and smaller diameter wire than corner gate molding. Gold wire diameter can be reduced by over 50% to 0.5mm. Copper wire diameters can also be reduced significantly. With PGM …
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MX's RDL, copper wire bonding processes take aim at packaging costs
… pads caused by higher mechanical stresses. Copper wire bonding will save materials costs and increase conductivity over gold wire bonding. MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor …
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Copper wire bonding offered from Quik-Pak
… Copper also exhibits high mechanical strength. Intermetallic growth in copper bonds is significantly slower than in gold wire bonds, creating lower electrical resistance, lower heat generation, and increased long-term bond reliability. Once …
