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  1. Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology

    Article

    Wed, 16 May 2012

    improved to 3µm, and ASM's GoCU technology enables it to operate faster with lower-cost copper wire rather than with gold wire , maintaining accuracy. The Auto Wire Rethread System of the ASM iHawk Xpress ensures that the bonding wire is clamped

  2. Improved copper wire bonding with non-contact metrology

    Article

    Thu, 1 Mar 2012

    the need for imprint studies For the past 30 years, gold wire has predominated in the back end packaging semiconductor ..... rates than those that have been traditionally needed with gold wire bonding is required. Limitations of imprint evaluation

  1. Amplifier IC enables purely electronic nanopore measurement

    Article

    Mon, 19 Mar 2012

    Photo. The Columbia Engineering team's custom multichannel CMOS preamplifier chip, wire bonded to a circuit board with gold wire . SOURCE: Columbia Engineering. The electronic single-molecule measurement method allows observations in the range

  2. Glass-coated bonding wire targets copper, small diameter market

    Article

    Tue, 27 Mar 2012

    wafer companies, and fabless semiconductor companies will find RMW's solution a highly reliable alternative to using gold wire , which, until now, has been known the standard,” said Shimon Dahan, CEO, RED Micro Wire. "By providing cost

  3. Copper wire bonding offered from Quik-Pak

    Article

    Fri, 16 Dec 2011

    Copper also exhibits high mechanical strength. Intermetallic growth in copper bonds is significantly slower than in gold wire bonds, creating lower electrical resistance, lower heat generation, and increased long-term bond reliability. Once

  4. MX's RDL, copper wire bonding processes take aim at packaging costs

    Article

    Mon, 12 Dec 2011

    pads caused by higher mechanical stresses. Copper wire bonding will save materials costs and increase conductivity over gold wire bonding. MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor

  5. Tanaka establishes copper bonding wire production in Taiwan

    Article

    Tue, 31 Jan 2012

    from gold to copper wire bonds. Tanaka Denshi Kogyo has the world's leading share in bonding wire as a whole, and gold wire . Website: http://www.tanaka-bondingwire.com/ Tanaka Precious Metals has a diversified range of business activities

  6. NSMAT licenses Pd-coated Cu bonding wire to competitor

    Article

    Fri, 22 Jul 2011

    packaging, thanks to a unique structural design. It also offers high electrical conductivity, more than 20% higher than gold wire . EX1 went into mass production in 2009 and claims more than 80% of the copper bonding wire market share. It has been

  7. Amkor transitions PBGA packaging to pin-gate molding

    Article

    Fri, 4 Nov 2011

    socket insertion and shipping. PGM uses higher density substrates and smaller diameter wire than corner gate molding. Gold wire diameter can be reduced by over 50% to 0.5mm. Copper wire diameters can also be reduced significantly. With PGM

  8. Semicon West, Day 0: Market forecasts, supply-chain dynamics

    Article

    Mon, 11 Jul 2011

    expected for 2012. Gold bond wire is being replaced by copper, but is still >80% of the market, with 80% of that gold wire <25μm in diameter. Packaging materials are forecast to be $21.4B in 2011, up 4.5% over 2010 with a further gain

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