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Glass Frit

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  1. Integration and 3D-ICs driving developments in wafer bonding

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    Sat, 1 Oct 2011

    … the most important requirements. Glass frit as a packaging material results in ..... MEMS devices are manufactured using glass frit wafer bonding. Accelerometers and ..... cost of MEMS devices. Instead of glass frit , which creates seal rings with a width …

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  2. Wafer Bonder
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