Gallium Arsenide
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Ultrapure GaAs exhibits new states of matter
Purdue University researchers have created an ultrapure gallium arsenide (GaAs) semiconductor crystals that capture new states of matter, with potential applications in future high-speed quantum computing.
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Silicon interposers: building blocks for 3D-ICs
Silicon interposers seem set to stay as a valid alternative implementation to full 3D-IC designs. Matthew Hogan, Mentor Graphics, Wilsonville, OR
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Robotic die bonder upgrades SET packaging platform
The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.
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FEI intros S/TEM with Sandia Labs order
FEI Company (NASDAQ:FEIC) released the Titan G2 80-200 scanning/transmission electron microscope (S/TEM) with ChemiSTEM Technology and accelerating voltage range of 200-80kV.
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Organic Electronics Workshop: TFTs, FETs, and a seeing microphone
Techcet's Michael A. Fury reports from the Organic Microelectronics & Optoelectronics Workshop in San Francisco, where talks delved into flexible displays, organic molecular tunnel junctions, thin-film microprocessors, and a microphone that can "see" sound.
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Copper pillars appear in packages from Amkor to Unisem, says Vardaman
Following Intel's lead, many companies are moving to adopt copper pillar as the technology for their flip chip applications, as well as leadframe packages. E. Jan Vardaman, president of TechSearch International, says the move to Cu pillar is reminiscent of the transition from the evaporated bump to
