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miniaturized and functional heterogeneous modules with particular focus on high-yield, low-cost, chip-last embedding with FR4 -compatible manufacturing-processes; and interconnections and assembly processes compatible with existing infrastructure
world of electronic devices, replacing FR4 -based sensor assemblies with nano-systems ..... conformal coatings that were sufficient for FR4 board assemblies are insufficient to protect ..... protection. All manufacturers moving from basic FR4 technology to MEMS sensor devices in their