Fr4
Fr4 news and technical articles from Solid State Technology Magazine. Search Fr4 latest and archived news and articles
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CCT Laser Services Inc
… trimming services on thick film, thin film, UTF, and circuits. Also provides laser micromachining on silicon, stainless steel, FR4 , polyimides, ceramic, metallized layers on ceramic substrates, and PCB solder mask removal. Custom software, processes …
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Understanding tester interfaces
… trace) is at 1.6% per inch of trace in FR4 . At 5GHz, the loss due to skin effect ..... Interference (ISI). Figure 3. A comparison of FR4 to Getek. The waveform in Fig. 3 shows ..... 200ps. The trace, which is 50.2W in FR4 , is compared to a 53.3-W trace with the …
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Parylene protects MEMS assemblies
… world of electronic devices, replacing FR4 -based sensor assemblies with nano-systems ..... conformal coatings that were sufficient for FR4 board assemblies are insufficient to protect ..... protection. All manufacturers moving from basic FR4 technology to MEMS sensor devices in their …
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Osram devises LED solder pad concept for easier second sourcing
… that it can be used for LED components from at least two different manufacturers. The concept can also be used for metal core, FR4 , and ceramic boards. For both LED components, the luminous area is in the same lateral position on the board. If the LEDs …
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Advanced packaging technologies: Imbedding components for increased reliability
… substrate. Test patterns on the high-temperature FR-4 (HT- FR4 ) laminate substrate enabled in-situ resistance monitoring of ..... ingression). The test coupon comprised a 4.000 × 6.000″ HT- FR4 substrate, laminate PCB, in three tiers, with an imbedded …
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Ultrathin, stackable QFN packages
… reducing via diameter to 30μm. The chip is adhesively bonded to an FR4 core that is also 50μm thick. When the chip is overlaid with resin ..... 160μm thick. Later this year, Ostmann says, the 50μm thick FR4 core may be replaced with a much thinner copper core. This change …
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Georgia Tech targets thin 3D packaging with new consortium
… miniaturized and functional heterogeneous modules with particular focus on high-yield, low-cost, chip-last embedding with FR4 -compatible manufacturing-processes; and interconnections and assembly processes compatible with existing infrastructure …
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Fast-curing conductive chip-attach adhesive meets RFID packaging needs
… to defined positions on the RFID antenna. It cures in 6 seconds at 190°C with a thermode and adheres to PET, polyimide, FR4 , copper, aluminum and silver substrates. Up to 20,000 microchips can be bonded per hour on a flip-chip production system …
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RF SoP for Multi-band RF and Millimeter-wave Systems
… advanced multilayer organic substrates using FR4 and advanced materials such as liquid crystal ..... They use an inexpensive substrate such as FR4 and a low-cost advanced epoxy and polyimide ..... density module with a motherboard, such as FR4 board. Top and bottom substrates are dedicated …
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Flip Chip Solder Joint Failure Modes
… aluminum (Al) conductor trace. The silicon die is attached on a FR4 PCB through eutectic Pb37/Sn63 solder joints. Copper plates ..... wetting with both Ni UBM on the Si die side and Cu plate on the FR4 side. Therefore, Al trace contributed to most of the resistance …
