Flip Chip
Flip Chip news and technical articles from Solid State Technology Magazine. Search Flip Chip latest and archived news and articles
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Altera taps Amkor for molded flip chip packaging of FPGA family
… will use an exposed-die molded flip chip technology from semiconductor packaging ..... its 28nm Arria V FPGA. Amkor’s flip chip molded ball grid array (FCmBGA ..... spacing between passives and the flip chip die, with reportedly improved solder …
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Flip chip still in growth phase, even at $16B
… 2011 -- Yole Développement's new report, " Flip - Chip : Technologies, Applications, Market report – April ..... of the world's highest value package platform, flip chip . Flip - chip packages accounted for 13% of all integrated circuit …
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Flip chip bumping, WLP partnership unites FCI and NANIUM
March 6, 2012 - PRNewswire -- Flip chip bumping and wafer-level packaging (WLP) supplier FlipChip ..... manufacturing, test and engineering services provider, for 300mm flip chip bumping and WLP . The partnership revolves around NANIUM …
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Kyocera doubles flip -chip assembly with new cleanroom in US
… Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic ..... Manufacturer's List (QML)-certified flip - chip assembly provider. The cleanroom can fabricate fine-pitch flip - chip multiple components within one operation …
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Flip chip probe card from Wentworth Laboratories withstands high-power, high-density test
… probe card for "severe test parameters" in high-volume flip chip /C4 test . AccumaxDirect handles: high density pin counts ..... scenarios. The probe card is designed to test high-power flip chip devices such as microprocessor units (MPUs), graphics …
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One year later: Amkor/TI high-density copper pillar bump technology
… s first fine pitch copper pillar flip chip packages—shrinking bump pitch up ..... compared to then current solder bump flip chip technology. Very little technical ..... Zwenger and TI's Mark Gerber. Flip chip technology has traditionally been …
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David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012
… most recently leading the BGA, Flip Chip and MEMS product groups. He was ..... development, large die/lead free flip chip development, and wafer level product ..... Engineering, Product Engineering, and Flip Chip implementation. His last role at …
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Intel’s top suppliers in 2011
… ceramic capacitors. Rofin-Baasel supplies laser mark equipment. Samsung Electro-Mechanics Co., Ltd. supplies flip chip substrates. Siliconware Precision Industries Co., Ltd. supplies semiconductor assembly and test services. STATS ChipPAC …
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One-piece jetting cartridge for semiconductor packaging inspired by ink jet designs
… jetting , with a newly designed jet cartridge and new software control for semiconductor packaging applications such as flip chip underfill, chip scale packages (CSP), ball grid arrays (BGA), package-on-package (PoP) underfill, precise …
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Driving down HB-LED package costs
… Lumileds has changed their LED structure, to enable flip - chip mounting of the LED on the AlN panel. This eliminates ..... enables a smaller, lower cost LED package. Expect more flip - chip LED designs. An analysis of packaged LEDs used for LCD …
