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  1. Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter

    Article

    Wed, 23 May 2012

    conventional high-resistance aluminum lead wires. The module’s chips include a SiC metal oxide semiconductor field effect transistor (MOSFET) and SiC schottky barrier diode (SBD). It is rated at 1,200V/300A. The power semiconductors

  2. Conference Report: MRS Spring 2012, Day 4

    Article

    Fri, 13 Apr 2012

    Charles Lieber at Harvard University took us on a tour of the frontier between biology and nanotechnology. The field effect transistor (FET) structure is readily adaptable to monitoring basic biological signals. Nanowire FETs can bring us into

  1. Graphene FET enables high-frequency mixer circuits

    Article

    Tue, 3 Jan 2012

    January 3, 2011 -- Chalmers University of Technology researchers created a novel subharmonic graphene field - effect transistor (FET) mixer at microwave frequencies, which could serve as the basis of more compact circuit designer at

  2. Cornell, SRC develop RF MEMS technologies

    Article

    Wed, 7 Dec 2011

    in this research is a single-crystal silicon micro-mechanical resonator acoustically coupled to junction field effect transistor (JFET) built on a SOI substrate. The high quality factor and low loss can be attributed to the use of single

  3. Transistor uses protons analogously to electrons for bio-compatibility

    Article

    Thu, 22 Sep 2011

    September 22, 2011 -- University of Washington materials scientists are working on a field - effect transistor (FET) that uses protons to communicate, rather than electrons. Translating an electronic signal to an ionic one, or vice versa

  4. Power management semiconductors grow after a rocky Q4 2011

    Article

    Thu, 24 May 2012

    the main growth area for these sectors, followed by low-voltage and high-voltage metal-oxide-semiconductor field - effect transistors (LV and HV MOSFETs). IHS (NYSE: IHS) is a leading source of information, insight and analytics in critical areas

  5. Graphene grown on 300mm wafers with AIXTRON tool in Japan

    Article

    Thu, 12 Apr 2012

    of layers. The work will go into creating low-voltage-operation complementary metal oxide semiconductor (CMOS) field - effect transistors (FETs), in which the power supply voltage will be less than 0.3V. Dr. Shintaro Sato, AIST, presented the growth

  6. IEDM 2011: Three 5nm FETs battle in ultimate device scaling

    Article

    Mon, 28 Nov 2011

    Paper #11.2, "Ultimate Device Scaling: Intrinsic Performance Comparisons of Carbon-Based, InGaAs and Si Field - Effect Transistors for 5-nm Gate Length"] Next slide: Straining the limits of CMOS with Ge, III/V Previous slide: Hollow copper

  7. IEDM 2011: InGaAs trigate MOSFET

    Article

    Mon, 28 Nov 2011

    1, "Electrostatics Improvements in 3-D Tri-Gate Over Ultra-Thin Body Planar InGaAs Quantum Well Field Effect Transistors with High-K Gate Dielectric and Scaled Gate-to-Drain/Gate-to-Source Separation"] Next slide

  8. GaN-on-Si advances from Translucent and Bridgelux

    Article

    Mon, 15 Aug 2011

    for gallium nitride (GaN) device growth. The main target applications include light-emitting diodes (LED) and field - effect transistors (FET). The III-N semiconductors family uses scalable GaN-on-Si wafers: crystalline REO layers provide stress

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