Fan Out Wafer Level Packaging
Fan Out Wafer Level Packaging news and technical articles from Solid State Technology Magazine. Search Fan Out Wafer Level Packaging latest and archived news and articles
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STATS ChipPAC brings FOWLP to stacked packages for
… standard is 1.4mm total stacked package height, 30% more than STATS ChipPAC's new 3D eWLB. STATS uses fan - out wafer level packaging (FOWLP) to reduce the bottom PoP package height below 0.5mm. The technology also offers tighter substrate …
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Georgia Tech produces 130um 3D organic semiconductor package
… die embedding. Georgia Tech asserts that this form of yield management is superior to that available with fan - out wafer - level packaging (FOWLP) and chip-first embedding. The first set of functional WLAN receiver modules fabricated using …
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STATS ChipPAC widens fan-out WLP configurations with TSVs, IPDs
May 31, 2011 - STATS ChipPAC says it has widened its range of packaging configurations for its fan - out wafer - level packaging technology. Integrating through-silicon via (TSV) with integrated passive devices (IPD), on the company …
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Temporary wafer bonding market: More than 10 approaches today
… semiconductor wafers (down to 50µm) for advanced packages with through silicon vias (TSV), interposers, or fan - out wafer - level packaging (FOWLP); power devices like IGBTs, RF devices, and LEDs. Because ultra-thin wafers are less stable …
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Report examines fan -out wafer -level packaging momentum, assembly pricing trends
November 16, 2011 - A host of companies are offering, or are in development with, fan - out wafer - level packaging (FO-WLP) for devices with large numbers of I/Os as an alternative to going finer-pitch (0.3-0.35mm) to keep using …
