Facilities And Contamination Control
Facilities And Contamination Control news and technical articles from Solid State Technology Magazine. Search Facilities And Contamination Control latest and archived news and articles
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Scaling-up PV fabs? Make tagging your friend
Solar cell manufacturing technologies are advancing and proliferating. To avoid confusion and potential hazards when your fab goes from a handful of people to hundreds, implement an equipment tagging system, says blogger Steve Blaine, CH2M HILL.
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Fabless revenue doubles in China by 2015
Vincent Gu, IHS iSuppli, summarizes the drivers -- domestic demand, quality and technology expectations in consumer devices -- and the challenges -- competing for capacity, low penetration in logic ICs -- for China's fabless IC designers.
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OLED process dev aim of Moser Baer's DOE $2.9M grant
The US DOE is giving Moser Baer $2.9 million to reduce the cost of manufacturing high-efficiency OLED lighting panels via improved processing steps.
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Cosense ultrasonic liquid level detectors best mechanical float switches
Cosense launched the SL 900 Series of Ultrasonic Liquid Level Detectors that detect and micro-measure ultrapure chemical fluids for semiconductor chip manufacturing.
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Nanotechnology company RMTS relocates to work with CNSE
Nanotechnology company RMTS relocated from CO to NY to launch an R&D partnership with CNSE at the University at Albany, developing nano-polarization technologies for displays and windows.
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AMAT debuts DRAM fab tools for denser transistors
Applied Materials debuted 3 systems for next-generation DRAM chip manufacturing: the Applied Centura DPN HDTM system to improve the gate insulator scaling; the Applied Endura HAR Cobalt PVD system for high-aspect-ratio contact structures; and the Applied Endura Versa XLR W PVD system for reduced ...
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Suss joins imec's EUV mask integrity work
Suss Microtec and imec are expanding a research collaboration in mask cleaning to develop an in-fab approach to EUV lithography mask integrity, aiming to develop a sophisticated approach to preserving mask integrity prior to exposure.
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3D IC with TSV show significant advances in last 12 months
Dr. Phil Garrou summarizes the significant commercial strides made over the past 12 months in 3D IC integration -- as defined vs. other "3D" technologies -- thanks to the promised combination of low cost and high performance.
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TESCAN combines nano-analysis tools in one platform
TESCAN introduced the LYRA GM focused ion beam and scanning electron microscope (FIB--SEM) workstation, calling the system a multifunctional tool for nanotechnology.
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CNSE adds mask aligner for MEMS fab
ClassOne Equipment sold its 150th mask aligner, which will be installed in the Smart System Technology & Commercialization Center of the College of Nanoscale Science and Engineering (CNSE) at UAlbany.
