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2006 - XACTIX Inc. and Surface Technology Systems PLC announced a comprehensive line of production-oriented release etching tools for MEMS. The tools produced under this collaboration use xenon difluoride gas to perform a highly selective isotropic
equipment provider, and Surface Technology Systems, who creates plasma process technologies, have released a suite of etching tools specific to MEMS, combining STS and XACTIX products. The xenon difluoride silicon-etch systems enable unconventional
Click here to enlarge image Aug. 4, 2003 -- Surface Technology Systems plc , a respected supplier of deep- etching tools to MEMS researchers, is now ready to serve the market for full-scale MEMS production. It just hopes the market
already contributed significantly to cost reduction in lithography, plasma, and PVD processing. The market for dry etching tools is still growing in 2012 due to increasing adoption for patterned sapphire substrates (PSS). Most lithography tools
with the dip in 2009 due to (i) the pause in capacity from market oversupply, and (ii) an increase in wet- etching tools used for junction isolation. Similar revenue projections have been presented during the past 12 months [31-33
with the dip in 2009 due to (i) the pause in capacity from market oversupply, and (ii) an increase in wet- etching tools used for junction isolation. Similar revenue projections have been presented during the past 12 months [31-33
significantly increase its throughput, and major tool suppliers now developing it further are on track to have 100µm/min etching tools on the market within two to three years. The relatively slow speed of etching out deep features remains a bottleneck
significantly improve its throughput, and major tool suppliers now developing it further are on track to have 100µm/min etching tools on the market within two to three years. The relatively slow speed of etching out deep features remains a bottleneck
company president/CEO Steve Newberry said he expects flat capital spending for the company's core business of etching tools , and warned of a 5%-7% sequential decline in 1Q07 (vs. earlier-projected 5%-10% increase) due to customer
manufacturing, especially for in situ applications on wafer-processing tools within lithography chambers or in plasma- etching tools , often depends on its capability to provide an idealized set of performance characteristics. It must be automated