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Etching Process

Etching Process news and technical articles from Solid State Technology Magazine. Search Etching Process latest and archived news and articles

  1. The effect of pumping methods on wet etching processes

    Article

    Wed, 4 Apr 2012

    the traditional diaphragm pumps (D1 and D2) for an etching process . The D1 has low pulsation intensity and high frequency ..... operated in swing mode is preferred for single wafer etching process as it shows high etch rate with lower etch rate uniformity

  2. Predicting plasma in wafer etch and deposition via quantum mechanics

    Article

    Mon, 7 Nov 2011

    consider Si etching performed using Ar/HBr plasmas. TEL has experimentally determined etch profiles for the Ar/HBr etching process at a range of pressures [3]. Comparing the shapes of the etch profiles obtained with the lowest pressure (40mTorr

  1. Graphene doping doesn't need its own step when done on the edge

    Article

    Mon, 7 Nov 2011

    applied using plasma etching, Brenner said. Controlling the specific atoms used in the plasma, or conducting the etching process in an environment containing specific atoms, could drive those atoms into the edges where they would serve as dopants

  2. AVS Symposium 2011: A pre-show highlight reel

    Article

    Tue, 11 Oct 2011

    packaging for MEMS; Plasma etch challenges (profile control, feature level uniformity, plasma microdamage); a dry etching process for phase-change memory; selective etch processes for magnetic materials (Ni, Co, Ta) High- k dielectrics

  3. ScanNano partners with STMicroelectronics on MEMS devices

    Article

    Thu, 27 Oct 2011

    have multi-gap or multi-nano-gap structures. Present technology requires the use of a sacrificial layer and an etching process which limits the minimum size of the gap because it is more difficult to etch thinner sacrificial layer materials

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