Etch
Etch news and technical articles from Solid State Technology Magazine. Search Etch latest and archived news and articles
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FSI wins wafer clean tooling orders from FEOL and BEOL customers
FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.
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SINGULUS thin film solar cell tool cleans rear and sides in 1 step
The new tool simultaneously cleans back-sides and edges of thin film solar cells in a single step. It protects the active layer from etch by process hoods and performs pencil and rear side etching with brushes and chemicals.
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Extending optical lithography with complementary e-beam lithography
David Lam summarizes how the industry does not have to "throw out" optical lithography as it proceeds to more advanced nodes -- complementary e-beam lithography (CEBL) is part of the overall solution, "complementary lithography," that can overcome the resolution limitations of 193i technology.
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AMEC reactive ion etch tool enables sub-28nm nodes
AMEC launched its Primo 300mm very-high-frequency advanced decoupled reactive ion etch tool for sub-28nm. AMEC's Ben Lee describes the tool's mini-batch cluster architecture, and the physics that makes it work.
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SEMICON West 2011, Day 1: SOI vs. FinFET, ReRAM vs. 3D NAND, and lots of video data
The TechXPOT session on Emerging Architectures for Logic and Memory provided a number of interesting perspectives on some of the big transitions in device technologies, which seem to be arriving at an ever-increasing pace, reports Olov Karlsson from Intermolecular.
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Cambrios and Hitachi Chemical Collaborate on Conductive Film
Cambrios Technologies Corporation announced that the company’s ClearOhm silver nanowire coating materials have been combined with Hitachi Chemical’s photosensitive film technology to develop a very highly transparent conductive film that can be transferred to various substrates such as glass, ...
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Gigaphoton extends DUV another generation, makes progress on EUV conversion efficiency
Gigaphoton expects to deliver an EUV source to ASML at the beginning of 2012. In the meantime, the company is focusing on throughput, conversion efficiency, and debris mitigation with its EUV source. Phil Alibrandi, director of sales at the company, summarized the activities taking place to support
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Deep silicon etch from Oxford Instruments offers process flexibility
Oxford Instruments debuted the PlasmaPro Estrelas100 deep silicon etch technology for the MEMS R&D and fabrication market. The tool is designed to be flexible, accomodating multiple processes without changing chamber hardware, and multiple wafer sizes for R&D-to-production ramp.
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NCCAVS on 3D packaging: Bring on the TSVs
A standing-room crowd gathered at SEMI for a special NCCAVS usergroup meeting to hear about issues relevant to 3D packaging, including CMP for through-silicon vias (TSV), a DFM methodology for 3D TSV packaging designs, and TSV process integration challenges.
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Parylene protects MEMS assemblies
The latest developments in parylene have produced new formulations that offer even smaller molecular structures and superior thermal, UV and dielectric protection. Parylene conformal coating protects MEMS without damaging the fragile, nano-sized components. Alan Hardy, Specialty Coating Systems, ...
