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Oxford Instruments) September 20, 2007 -- Oxford Instruments and NIL Technology have collaborated to develop etch processes targeted specifically at nanoimprint lithography (NIL). NIL, a versatile, cost effective, and flexible high
30, 2002 -- Trikon Technologies Inc. has introduced a new DSi module for high rate, anisotropic, deep silicon etch processes for the fabrication of microelectromechanical systems (MEMS). The DSi is a new module based on Trikon's patented
targeted at developing additional CoSi and ferroelectric etch processes for new IC requirements. Expected to be completed ..... phase two is also targeted at the development of other etch processes for hard-to-etch materials. In addition to the
Petaluma, California overview Plasma etch processes can be tailored to address MEMS ..... to their present state, where etch processes allow precise control of plasma ..... platinum and PZT; and, for InP, etch processes optimized for elevated wafer temperatures
Sirius 6000 abatement system addresses greenhouse gas abatement challenges arising from dielectric and polysilicon etch processes used in semiconductor manufacturing. The company claims the unit uses an energy-efficient microwave plasma in a
Click here to enlarge image Laser ellipsometry (LE) and DUV reflectometry (DUVR) are now being used to monitor etch processes and reduce nonuniformities that had affected yield. Maps showing 49-point thickness and reflectance of an ARC
Overview Increasingly, new photoresists and novel polymer-rich plasma etch processes used in photomask manufacturing require that conventional wet stripping must be replaced with dry plasma-stripping techniques
300mm applications lab in Phoenix, AZ, to help its customers establish production-viable wafer cleaning and wet etch processes . At the root of SEZ's capabilities is its single-wafer multiple-zone tools that enable very tight control of
generation equipment. Total pressure will continue to be among the key physical parameters in advanced PVD, CVD, and etch processes . The 1-10 mtorr region has been problematic for traditional primary standards. Calibration of process instruments
isotropic). This is a well-known phenomenon in wet chemical etching. Simulation of the electrical and diffusion etch processes The two mechanisms of shape transformation described in the previous section appear to play different roles in the