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Etch Processes

Etch Processes news and technical articles from Solid State Technology Magazine. Search Etch Processes latest and archived news and articles

  1. Plasma etch challenges for FinFET transistors

    Article

    Tue, 10 Apr 2012

    Shallow trench isolation (STI) etch processes for conventional planar devices ..... most challenging of the FinFET etch processes . Challenge of atomic-precision ..... E > 0, and values for current etch processes typically range from approximately

  2. SPTS sends dry MEMS etch tool to China research institute

    Article

    Wed, 21 Mar 2012

    attack on exposed surfaces. The Primaxx Monarch 3 uses a 3-wafer process module for higher throughput and repeatable etch processes . SPTS’ HF vapor etch technology reportedly prevents stiction, which occurs during wet etch when the released microstructure

  1. KLA-Tencor enlarges monitor-wafer suite

    Article

    Wed, 7 Dec 2011

    process excursions, and track manufacturing trends. ET-SE delivers temperature wafer monitoring during silicon etch processes , providing temperature measurements with a higher signal-to-noise ratio than alternative methods. ET-SE assists

  2. Semiconductor process technology challenges at 22nm

    Article

    Wed, 28 Dec 2011

    The number of electrons on the gate continues to shrink, making reliability and repeatability of deposition and etch processes critical to NAND yields. 2xnm and 1xnm NAND are expected to be roughly 4% of the 19,000 Petabytes total production

  3. Mass flow controller from Brooks Instrument gains safer delivery

    Article

    Mon, 12 Sep 2011

    GF120 SDS is a low-pressure drop mass flow controller that delivers sub-atmospheric SDS gases used in implant and etch processes . Sub-atmosphereic SDS gases are adsorbed onto a solid medium within the gas cylinder, remaining below atmospheric

  4. AVS Symposium 2011: A pre-show highlight reel

    Article

    Tue, 11 Oct 2011

    control, feature level uniformity, plasma microdamage); a dry etching process for phase-change memory; selective etch processes for magnetic materials (Ni, Co, Ta) High- k dielectrics ( two parts ): High mobility channel materials beyond

  5. Improved post-etch metal and oxide residue removal yields

    Article

    Thu, 3 Nov 2011

    residue that can result from certain metal and oxide etch processes . A wider bath process temperature range gives engineers ..... drift prior to the cleaning step. In certain cases, etch processes prior to cleaning can generate excess polymer residues

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