Equipment
Equipment news and technical articles from Solid State Technology Magazine. Search Equipment latest and archived news and articles
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Scaling-up PV fabs? Make tagging your friend
Solar cell manufacturing technologies are advancing and proliferating. To avoid confusion and potential hazards when your fab goes from a handful of people to hundreds, implement an equipment tagging system, says blogger Steve Blaine, CH2M HILL.
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FSI wins wafer clean tooling orders from FEOL and BEOL customers
FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.
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Cosense ultrasonic liquid level detectors best mechanical float switches
Cosense launched the SL 900 Series of Ultrasonic Liquid Level Detectors that detect and micro-measure ultrapure chemical fluids for semiconductor chip manufacturing.
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Semiconductor industry executives: Can't miss events at SEMICON West
To maintain profitability and growth in the next 10 years, semiconductor executives must understand and successfully execute lab-to-fab transitions of new technologies. 2 SEMICON West sessions aim to tackle these issues.
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Korean IDM orders NEXX tools for WLP metallization
NEXX Systems installed 2 300mm Stratus deposition at a Korean IDM for high-volume wafer-level packaging processes.
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Semiconductor gases bounce back, wet chemicals on their way
Semiconductor wet chemicals saw 13% growth year-over-year in 2010, while the electronics fab gasses market grew 16%, according to 2 new reports from Techcet Group.
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AMAT debuts DRAM fab tools for denser transistors
Applied Materials debuted 3 systems for next-generation DRAM chip manufacturing: the Applied Centura DPN HDTM system to improve the gate insulator scaling; the Applied Endura HAR Cobalt PVD system for high-aspect-ratio contact structures; and the Applied Endura Versa XLR W PVD system for reduced ...
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Olympus inspects bonded wafers with IR microscopy
Greg Baker, Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on IR metrology for defect inspection of bonded wafers. Olympus-ITA launched the latest 3DIR Metrology and Defect Review System at SEMICON West 2011, booth 1524.
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Power management ICs for green energy applications
Executive Overview The power management IC (PMIC) has become a critical component in virtually every electronics product today. Much of this demand is being fueled by the global transition to green energy solutions. Highlighted will be a 0.18m BCDMOS process with 30V LDMOS transistors having an Rsp
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Performance enhancements for multi-die DRAM packages
R. Crisp, et al., Tessera, San Jose, CA USA; W. Chang, et al., Powertech Technology Inc., Hsinchu, Taiwan, R.O.C
