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Equipment Supplier news and technical articles from Solid State Technology Magazine. Search Equipment Supplier latest and archived news and articles
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AMAT loses top spot in VLSIresearch semiconductor equipment supplier rankings
… 2011. (2011 Exchange rates). Lithography spending enabled ASML to become the largest equipment supplier . ASML and fellow lithography equipment supplier Nikon grew 27% combined. Overall, the top 15 semiconductor equipment suppliers grew …
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memsstar appoints CEO with semiconductor and packaging experience
May 8, 2012 -- memsstar Limited, deposition and etch equipment supplier to the micro electro mechanical systems (MEMS) and semiconductor industries, named Mike Thompson as chief executive officer …
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Logic fab orders MTSN rapid thermal anneal for volume ramp
… semiconductor manufacturer placed a follow-on order with Mattson Technology Inc. (NASDAQ:MTSN), wafer fab equipment supplier , for a Millios millisecond annealing system (MSA) . The chip maker will use the Millios MSA in volume production …
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Silicon wafers sliced to 10% conventional bulk with Hyperion 3
March 14, 2012 - Marketwire -- Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier , debuted its first commercial wafer production system that reduces solar module and semiconductor device wafers …
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TEL acquires advanced packaging tool supplier NEXX
March 16, 2012 -- Tokyo Electron Limited (TEL) will acquire semiconductor packaging equipment supplier NEXX Systems Inc. NEXX makes advanced deposition equipment, including electrochemical deposition (ECD) and physical vapor deposition …
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SUSS Microtech adds Brewer Science ZoneBond to wafer bonders
… wafer handling, will offer the ZoneBOND process on equipment supplier SUSS MicroTec's XBC300 and XBS300 wafer bonding ..... after the ZoneBOND technology was commercialized , equipment supplier EV Group (EVG) launched ZoneBond-capable modules …
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Hesse & Knipps opens wedge bonder demo lab on West Coast
February 15, 2012 -- Hesse & Knipps Inc., the Americas subsidiary of backend packaging equipment supplier Hesse & Knipps Semiconductor Equipment GmbH, opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman …
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EVG doubles process module space in XT Frame platform
December 5, 2011 - PRNewswire -- EV Group (EVG), wafer bonding and lithography equipment supplier , introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for …
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ASM brings Fraunhofer into ALD and CVD process dev
December 10, 2011 -- Fraunhofer CNT and semiconductor fab equipment supplier ASM International NV will collaborate under a Joint Development Agreement on various new projects over the next 5 years, including …
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FSI wins wafer clean tooling orders from FEOL and BEOL customers
June 7, 2011 -- FSI International Inc. ( Nasdaq:FSII ), surface conditioning equipment supplier , won orders for multiple ORION single wafer cleaning systems . A memory maker will use the ORION in wet photoresist strip and …
