Equipment And Materials
Equipment And Materials news and technical articles from Solid State Technology Magazine. Search Equipment And Materials latest and archived news and articles
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New SEMI standard for silicon photovoltaics feedstocks
Download the new standard, SEMI PV17-0611: Specification for Virgin Silicon Feedstock Materials for Photovoltaic Applications, covering virgin silicon feedstock materials grades, terminology, and tests to validate materials.
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SEMICON West Day 2: CMP views, outlooks for breakfast
Techcet's Michael A. Fury continues his reporting from SEMICON West, reviewing talks at the NCCAVS CMP User Group forum, as well as a breakfast seminar with outlooks on the semiconductor and related industries.
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SigmaTech TSV metrology wins Best of West
SigmaTech's UltraMap-TSV system won Best of West at SEMICON West, presented by industry association SEMI and Solid State Technology.
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SolRayo nanotechnology improves high-temp lithium batteries
SolRayo completed its Phase I STTR work with a successful nano coating that improves lithium battery life by a factor of 3 in high-temperature extreme environments. The company is looking to a Phase II grant and commercial partners.
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Edwards talks PV throughput, environmental improvements
Mike Allison, executive VP of Edwards, describes how solar photovoltaics (PV) manufacturers are looking to up productivity and drive the cost curve down, ever hunting the lowest cost/Watt.
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Semprius HCPV pilot line lands in NC
North Carolina gave Semprius a $7.88+ million incentives package to build its pilot production plant in Henderson, NC. The plant could employ over 200 people with 35MW capacity.
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Buckyballs "cook" on ruthenium into uniform quantum dots
Scientists from A*STAR and the National University of Singapore heated buckyballs on a ruthenium substrate until the carbon masses fell apart into graphene-based quantum dots. The technique could be tuneable.
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Cambrios and Hitachi Chemical Collaborate on Conductive Film
Cambrios Technologies Corporation announced that the company’s ClearOhm silver nanowire coating materials have been combined with Hitachi Chemical’s photosensitive film technology to develop a very highly transparent conductive film that can be transferred to various substrates such as glass, ...
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TSV zen comes down to wafer processing balance
3D semiconductor packaging processes involve various groups, and standards are important in the hand-offs between them, explains Mark Berry, sales director at Metryx. He covers how to use metrology to protect wafer yields in 3D packaging.
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No clear trend in June fab tool numbers
North America-based manufacturers of semiconductor equipment posted $1.55 billion in orders in June 2011 (three-month average basis) and a book-to-bill ratio of 0.94, according to the June Book-to-Bill Report published by SEMI.
